Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces
文献类型：期刊论文
| 作者 | Gao, Zhaoqing1,2,3; Wang, Chen2; Gao, Nan2; Guo, Shihao2; Chen, Yinbo1,3; Chai, Zhenbang2,4; Wang, Yunpeng2; Ma, Haitao2 |
| 刊名 | SURFACES AND INTERFACES
 |
| 出版日期 | 2022-06-01 |
| 卷号 | 30页码:12 |
| ISSN号 | 2468-0230 |
| 关键词 | Ni-W-graphene coatings Interfacial reaction barrier CuGa 2 layer Ga-21 5In-10Sn liquid alloys Ni -W solid solution |
| DOI | 10.1016/j.surfin.2022.101838 |
| 通讯作者 | Wang, Yunpeng(yunpengw@dlut.edu.cn) ; Ma, Haitao(htma@dlut.edu.cn) |
| 英文摘要 | In this study, the long-term (up to 400 days) room temperature aging tests for Ga-21.5In-10Sn/Cu interface were investigated, confirming the formation of intermetallic compounds at room temperature could cause the serious interfacial instability issues. One novel strategy using solid solution alloys with high thermal stability and high diffusion activation energy to design the barrier layer materials to inhibit the diffusion of solid atoms or interfacial reactions was proposed. The feasibility of Ni-W and Ni-W-graphene coatings as the interfacial reaction barrier of Ga-21.5In-10Sn/Cu liquid-solid interfaces was explored, indicating a novel application of Ni-W electroplated coatings in electronic/electrical contacts fields besides these traditional applications in wear-resistance, corrosion-resistance and heat corrosion resistance fields. The challenging agglomeration issues of graphene in water soluble solutions was successfully solved using the ethylene glycol as the effective dispersant. The temperature dependence of Ni-W and Ni-W-graphene coatings as the interfacial reaction barrier was compared. It was preliminarily contended that the addition of graphene particles was detrimental to improve the reaction barrier properties of Ni-W matrix. This finding provides a novel strategy to solve the interfacial instability problem of Ga-21.5In-10Sn/Cu interfaces and will enable wider applications of electroplated Ni-W coatings, promoting the development of soft and stretchable Ga-based alloys/Cu conductors in wearable electronics. |
| 资助项目 | Nation Natural Science Foundation of China[51871040] |
| WOS研究方向 | Chemistry ; Materials Science ; Physics |
| 语种 | 英语 |
| 出版者 | ELSEVIER |
| WOS记录号 | WOS:000782283600002 |
| 资助机构 | Nation Natural Science Foundation of China |
| 源URL | [http://ir.imr.ac.cn/handle/321006/172833]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Wang, Yunpeng; Ma, Haitao |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China 3.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 4.Tokyo Inst Technol, Dept Mat Sci & Engn, Tokyo 1528552, Japan |
| 推荐引用方式 GB/T 7714 | Gao, Zhaoqing,Wang, Chen,Gao, Nan,et al. Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces[J]. SURFACES AND INTERFACES,2022,30:12. |
| APA | Gao, Zhaoqing.,Wang, Chen.,Gao, Nan.,Guo, Shihao.,Chen, Yinbo.,...&Ma, Haitao.(2022).Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces.SURFACES AND INTERFACES,30,12. |
| MLA | Gao, Zhaoqing,et al."Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces".SURFACES AND INTERFACES 30(2022):12. |
入库方式： OAI收割
来源：金属研究所
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