Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires
文献类型：期刊论文
| 作者 | Sun, Pengfei1,3; Li, Zhiwei2; Hou, Jiapeng1; Xu, Aimin2; Wang, Qiang1; Zhang, Yi2; Zhang, Zhenjun1; Zhang, Penglin3; Zhang, Zhefeng1 |
| 刊名 | ADVANCED ENGINEERING MATERIALS
 |
| 出版日期 | 2022-03-27 |
| 页码 | 13 |
| ISSN号 | 1438-1656 |
| 关键词 | annealing electrical conductivity microstructure evolution oxygen-free copper wire strength |
| DOI | 10.1002/adem.202200037 |
| 通讯作者 | Hou, Jiapeng(jphou@imr.ac.cn) ; Zhang, Yi(zhfzhang@imr.ac.cn) |
| 英文摘要 | In the process of electric power transmission, the defects in the copper wire interact with the electrons which results in a thermal effect, accordingly, causing the changes of microstructure and properties of the copper wire. Herein, the evolution of microstructure, strength, and electrical conductivity of the oxygen-free copper wires annealed at different temperatures is investigated. In addition, the effects of various microstructures on strength and electrical conductivity are quantitatively revealed. In the low-temperature region (80-150 degrees C), dislocation recovery is the main reason for the decrease in strength; while, the increase in electrical conductivity is mainly due to the decrease in dislocation density and the transformation of grain boundary from nonequilibrium state to equilibrium state. In the high-temperature region (above 210 degrees C), the strength loss is mainly related to the increasing recrystallized grain size and the disappearance of dislocations in the recrystallized region. The increase in electrical conductivity is mainly attributed to the significant decrease in grain boundary density and the further recovery of dislocations. |
| 资助项目 | National Natural Science Foundation of China[52001313] ; State Grid Corporation of China[5211HD210003] ; China Postdoctoral Science Foundation[2019M661151] |
| WOS研究方向 | Materials Science |
| 语种 | 英语 |
| 出版者 | WILEY-V C H VERLAG GMBH |
| WOS记录号 | WOS:000773409700001 |
| 资助机构 | National Natural Science Foundation of China ; State Grid Corporation of China ; China Postdoctoral Science Foundation |
| 源URL | [http://ir.imr.ac.cn/handle/321006/173038]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Hou, Jiapeng; Zhang, Yi |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shi Changxu Innovat Ctr Adv Mat, 72 Wenhua Rd, Shenyang 110016, Peoples R China 2.Zhejiang Huadian Equipment Testing Inst, Natl Qual Supervis & Inspect Ctr Elect Equipment, Hangzhou 310015, Peoples R China 3.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China |
| 推荐引用方式 GB/T 7714 | Sun, Pengfei,Li, Zhiwei,Hou, Jiapeng,et al. Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires[J]. ADVANCED ENGINEERING MATERIALS,2022:13. |
| APA | Sun, Pengfei.,Li, Zhiwei.,Hou, Jiapeng.,Xu, Aimin.,Wang, Qiang.,...&Zhang, Zhefeng.(2022).Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires.ADVANCED ENGINEERING MATERIALS,13. |
| MLA | Sun, Pengfei,et al."Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires".ADVANCED ENGINEERING MATERIALS (2022):13. |
入库方式： OAI收割
来源：金属研究所
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