中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate

文献类型:期刊论文

作者Wang Jing1; Liu Gui-Chang2; Li Hong-Ling1; Hou Bao-Rong1
刊名ACTA PHYSICA SINICA
出版日期2012-03-01
卷号61期号:5页码:58102
关键词copper substrate diamond-like carbon graded intermediate layer thermal conductivity
ISSN号1000-3290
通讯作者Wang, J (reprint author), Chinese Acad Sci, Inst Oceanol, Key Lab Oratory Corros Sci, Qingdao 266071, Peoples R China.
英文摘要In recent years, with the rapid development of electronic technology and digital network information, copper has increasing applications in micro-electronics, micro-electro-mechanical systems and Hi-tech materials. However copper has its material limitations. In particular, it has relatively low hardness, high oxidation and wear rate, which have severely restricted its widespread applications. In this paper, aiming at difficulties of copper applications, Ti/TiC/DLC has been proposed as functionally graded material to deposit on the copper substrate with plasma depositing method, which intensifies the adhesion between DLC film and copper substrate and improves the properties of copper. The maximal value of thermal conductivity of DLC film with optimized parameter of graded intermediate layer is 3.63 Wm(-1).K-1, which enhances the heat transfer effect of copper substrate.
学科主题Physics, Multidisciplinary
收录类别SCI
语种英语
WOS记录号WOS:000303170800068
公开日期2013-09-24
源URL[http://ir.qdio.ac.cn/handle/337002/12482]  
专题海洋研究所_海洋腐蚀与防护研究发展中心
作者单位1.Chinese Acad Sci, Inst Oceanol, Key Lab Oratory Corros Sci, Qingdao 266071, Peoples R China
2.Dalian Univ Technol, Sch Chem Engn, Fac Chem Environm & Biol Sci & Technol, Dalian 116024, Peoples R China
推荐引用方式
GB/T 7714
Wang Jing,Liu Gui-Chang,Li Hong-Ling,et al. Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate[J]. ACTA PHYSICA SINICA,2012,61(5):58102.
APA Wang Jing,Liu Gui-Chang,Li Hong-Ling,&Hou Bao-Rong.(2012).Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate.ACTA PHYSICA SINICA,61(5),58102.
MLA Wang Jing,et al."Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate".ACTA PHYSICA SINICA 61.5(2012):58102.

入库方式: OAI收割

来源:海洋研究所

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