Soft and Self-Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling
文献类型：期刊论文
| 作者 | Yan, Qingwei; Alam, Fakhr E.; Gao, Jingyao; Dai, Wen; Tan, Xue; Lv, Le; Wang, Junjie; Zhang, Huan; Chen, Ding; Nishimura, Kazuhito |
| 刊名 | ADVANCED FUNCTIONAL MATERIALS
 |
| 出版日期 | 2021 |
| 卷号 | 31期号:36 |
| 关键词 | POLYMER COMPOSITES CONDUCTIVITY TRANSPORT GRAPHITE NANOCOMPOSITES NANOTUBES AEROGEL FOAMS |
| 英文摘要 | Urged by the increasing power and packing densities of integrated circuits and electronic devices, efficient dissipation of excess heat from hot spot to heat sink through thermal interface materials (TIMs) is a growing demand to maintain system reliability and performance. In recent years, graphene-based TIMs received considerable interest due to the ultrahigh intrinsic thermal conductivity of graphene. However, the cooling efficiency of such TIMs is still limited by some technical difficulties, such as production-induced defects of graphene, poor alignment of graphene in the matrix, and strong phonon scattering at graphene/graphene or graphene/matrix interfaces. In this study, a 120 mu m-thick freestanding film composed of vertically aligned, covalently bonded graphene nanowalls (GNWs) is grown by mesoplasma chemical vapor deposition. After filling GNWs with silicone, the fabricated adhesive TIMs exhibit a high through-plane thermal conductivity of 20.4 W m(-1) K-1 at a low graphene loading of 5.6 wt%. In the TIM performance test, the cooling efficiency of GNW-based TIMs is approximate to 1.5 times higher than that of state-of-the-art commercial TIMs. The TIMs achieve the desired balance between high through-plane thermal conductivity and small bond line thickness, providing superior cooling performance for suppressing the degradation of luminous properties of high-power light-emitting diode chips. |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/21816]  |
| 专题 | 中国科学院宁波材料技术与工程研究所 2021专题_期刊论文 |
| 作者单位 | 1.Lin, CT (corresponding author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn NIMTE, Zhejiang Key Lab Marine Mat & Protect Technol, Key Lab Marine Mat & Related Technol, Ningbo 315201, Peoples R China. 2.Lin, CT (corresponding author), Univ Chinese Acad Sci, Ctr Mat Sci & Optoelect Engn, Beijing 100049, Peoples R China. 3.Wu, SD (corresponding author), Southern Univ Sci & Technol, Acad Adv Interdisciplinary Studies, Shenzhen 518055, Peoples R China. 4.Chen, D (corresponding author), Hunan Univ, Coll Mech & Vehicle Engn, State Key Lab Adv Design & Mfg Vehicle Body, Changsha 410082, Peoples R China. 5.Wu, SD (corresponding author), Southern Univ Sci & Technol, Guangdong Hong Kong Macao Joint Lab Photon Therma, Shenzhen 518055, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Yan, Qingwei,Alam, Fakhr E.,Gao, Jingyao,et al. Soft and Self-Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling[J]. ADVANCED FUNCTIONAL MATERIALS,2021,31(36). |
| APA | Yan, Qingwei.,Alam, Fakhr E..,Gao, Jingyao.,Dai, Wen.,Tan, Xue.,...&Lin, Cheng-Te.(2021).Soft and Self-Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling.ADVANCED FUNCTIONAL MATERIALS,31(36). |
| MLA | Yan, Qingwei,et al."Soft and Self-Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling".ADVANCED FUNCTIONAL MATERIALS 31.36(2021). |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
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