Combining Alumina Particles with Three-Dimensional Alumina Foam for High Thermally Conductive Epoxy Composites
文献类型：期刊论文
| 作者 | Wang, Hao; Li, Linhong; Wei, Xianzhe; Hou, Xiao; Li, Maohua; Wu, Xinfeng; Li, Yong; Lin, Cheng-Te; Jiang, Nan; Yu, Jinhong |
| 刊名 | ACS APPLIED POLYMER MATERIALS
 |
| 出版日期 | 2021 |
| 卷号 | 3期号:1页码:216-225 |
| 关键词 | BORON-NITRIDE GRAPHENE NANOSHEETS POLYMER COMPOSITES CARBON NANOTUBES ENHANCEMENT MATRIX RESIN BN NANOCOMPOSITES CONSTRUCTION |
| 英文摘要 | Ceramic/polymer composite with a high thermal conductivity is a candidate of insulating materials for electronic packaging. However, traditional polymer composites filled with alumina (Al2O3) powders present limited enhancement in thermal conductivity even at a high loading due to thermal resistance on the filler/filler and filler/matrix interfaces. Herein, a contiguous 3D network of alumina foam (AF) filled with different diameters of Al2O3 microparticles via vacuum-assisted filtration proves to be a promising filler structure for thermal conductivity composites. The fabricated epoxy/AF/Al2O3 composite exhibits a high thermal conductivity of 4.1 W/mK and a significant thermal conductivity enhancement (TCE) of 2097%. Further study reveals a prominent synergistic effect between the 3D interconnected AF and Al2O3 microparticles, which plays a critical role in the formation of thermal percolation networks to promote thermal conductivity dramatically. Meanwhile, compared to previous reports, the composite resulted in a lower coefficient of thermal expansion (CTE) than those of most epoxy-based composites, showing great potential for heat conduction applications in microelectronics. This result paves an effective way of developing epoxy composites with high thermal conductivity in electronic packaging applications. |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/22293]  |
| 专题 | 中国科学院宁波材料技术与工程研究所 2021专题_期刊论文 |
| 作者单位 | 1.Yu, JH (corresponding author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Key Lab Marine Mat & Related Technol, Zhejiang Key Lab Marine Mat & Protect Technol, Ningbo 315201, Peoples R China. 2.Li, Y (corresponding author), Chinese Acad Sci, Tech Inst Phys & Chem, Key Lab Cryogen, Beijing 100190, Peoples R China. 3.Yu, JH (corresponding author), Univ Chinese Acad Sci, Ctr Mat Sci & Optoelect Engn, Beijing 100049, Peoples R China. 4.Wu, XF (corresponding author), Shanghai Maritime Univ, Coll Ocean Sci & Engn, Shanghai 201306, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Wang, Hao,Li, Linhong,Wei, Xianzhe,et al. Combining Alumina Particles with Three-Dimensional Alumina Foam for High Thermally Conductive Epoxy Composites[J]. ACS APPLIED POLYMER MATERIALS,2021,3(1):216-225. |
| APA | Wang, Hao.,Li, Linhong.,Wei, Xianzhe.,Hou, Xiao.,Li, Maohua.,...&Yu, Jinhong.(2021).Combining Alumina Particles with Three-Dimensional Alumina Foam for High Thermally Conductive Epoxy Composites.ACS APPLIED POLYMER MATERIALS,3(1),216-225. |
| MLA | Wang, Hao,et al."Combining Alumina Particles with Three-Dimensional Alumina Foam for High Thermally Conductive Epoxy Composites".ACS APPLIED POLYMER MATERIALS 3.1(2021):216-225. |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。