Low temperature seamless joining of SiC using a Ytterbium film
文献类型：期刊论文
| 作者 | Shi, Lin-Kun; Zhou, Xiaobing; Xu, Kai; Chang, Keke; Dai, Jian-Qing; Huang, Zhengren; Huang, Qing |
| 刊名 | JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
 |
| 出版日期 | 2021 |
| 卷号 | 41期号:15页码:7507-7515 |
| 关键词 | SILICON-CARBIDE CERAMICS TI3SIC2 TAPE FILM IN-SITU REACTION SICF/SIC COMPOSITES MECHANICAL-PROPERTIES HEAT-TREATMENT MICROSTRUCTURE STRENGTH JOINTS FILLER |
| 英文摘要 | Monolithic SiC, for the first time, was seamless joined at a low temperatu r e of 1200 degrees C using electric field-assisted sintering technology. A 300 nm Yb coating on SiC was used as the joining filler to form Yb3Si2C2 via an in-situ reaction with the SiC. A liquid phase was formed by an eutectic reaction between Yb3Si2C2 and SiC. Almost completely seamless joints were formed by the precipitated SiC grains, which were fully consolidated with the SiC matrix with the help of in-situ formed liquid phase, followed by its elimination under the uniaxial pressure. The bending strength of the seamless joint joined at 1500 degrees C for 15 min was as high as 257.2 +/- 31.1 MPa, which was comparable to the strength of the SiC matrix. As a result, the failure occurred in the matr i x indicated a sound joint was obtained. The proposed low temperature seamless joining could potentially be used for joining of SiC-based composite. |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/21284]  |
| 专题 | 2021专题_期刊论文 |
| 作者单位 | Zhou, XB (corresponding author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Engn Lab Adv Energy Mat, Ningbo 315201, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Shi, Lin-Kun,Zhou, Xiaobing,Xu, Kai,et al. Low temperature seamless joining of SiC using a Ytterbium film[J]. JOURNAL OF THE EUROPEAN CERAMIC SOCIETY,2021,41(15):7507-7515. |
| APA | Shi, Lin-Kun.,Zhou, Xiaobing.,Xu, Kai.,Chang, Keke.,Dai, Jian-Qing.,...&Huang, Qing.(2021).Low temperature seamless joining of SiC using a Ytterbium film.JOURNAL OF THE EUROPEAN CERAMIC SOCIETY,41(15),7507-7515. |
| MLA | Shi, Lin-Kun,et al."Low temperature seamless joining of SiC using a Ytterbium film".JOURNAL OF THE EUROPEAN CERAMIC SOCIETY 41.15(2021):7507-7515. |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
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