Self-regulated parallel process 3-D array microfabrication with metal direct-write
文献类型:期刊论文
作者 | Zhang, Yong; Lin, Yen-Po; Zhang, Xianyun; Zhang, Yifan; Guo, Jianjun |
刊名 | APPLIED MATERIALS TODAY
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出版日期 | 2021 |
卷号 | 24 |
关键词 | ELECTRODEPOSITION STRENGTH MAXIMUM |
英文摘要 | Parallel process direct-write manufacturing of ultrahigh aspect ratio 3-D metal microstructures remains one of the ultimate challenges in 3-D manufacturing. Its development promises novel solutions for high density chip scale packaging and sorting that require precision microscale mechanical and electrical interfaces to microelectronics. Herein, we exploited a self-regulated growth mechanism revealed in the meniscus-confined direct-write electro-deposition to realize the parallel process fabrication of high-density area arrays of ultrahigh aspect-ratio metal microwire structures. We demonstrated the direct-write fabrication of an array of curvilinear metal spirals over 800 mu m in height and 50 mu m in array spacing, structurally and mechanically appropriate for high density wafer probe testing applications that cannot otherwise be fabricated with any other existing methods. (C) 2021 Elsevier Ltd. All rights reserved. |
源URL | [http://ir.nimte.ac.cn/handle/174433/21522] ![]() |
专题 | 2021专题_期刊论文 |
作者单位 | 1.Zhang, Y (corresponding author), Georgia Inst Technol, Sch Aerosp Engn, 270 Ferst Dr NW, Atlanta, GA 30332 USA. 2.Guo, JJ (corresponding author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Zhejiang Key Lab Addit Mfg Mat, Ningbo 315201, Peoples R China. |
推荐引用方式 GB/T 7714 | Zhang, Yong,Lin, Yen-Po,Zhang, Xianyun,et al. Self-regulated parallel process 3-D array microfabrication with metal direct-write[J]. APPLIED MATERIALS TODAY,2021,24. |
APA | Zhang, Yong,Lin, Yen-Po,Zhang, Xianyun,Zhang, Yifan,&Guo, Jianjun.(2021).Self-regulated parallel process 3-D array microfabrication with metal direct-write.APPLIED MATERIALS TODAY,24. |
MLA | Zhang, Yong,et al."Self-regulated parallel process 3-D array microfabrication with metal direct-write".APPLIED MATERIALS TODAY 24(2021). |
入库方式: OAI收割
来源:宁波材料技术与工程研究所
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