Chip-level orthometric surface acoustic wave device with AlN/metal/Si multilayer structure for sensing strain at very high temperature
文献类型：期刊论文
| 作者 | Fanbing Hu; Lina Cheng; Shuyao Fan; Xufeng; Yong Liang; Minghui Liu; Wen Wang |
| 出版日期 | 2021 |
| 卷号 | 333期号:无页码:113298 |
| ISSN号 | 0924-4247 |
| 其他题名 | Chip-level orthometric surface acoustic wave device with AlN/metal/Si multilayer structure for sensing strain at very high temperature |
| 源URL | [http://159.226.59.140/handle/311008/9853]  |
| 专题 | 历年期刊论文_2021年期刊论文 |
| 作者单位 | 中国科学院声学研究所 |
| 推荐引用方式 GB/T 7714 | Fanbing Hu；Lina Cheng；Shuyao Fan；Xufeng；Yong Liang；Minghui Liu；Wen Wang. Chip-level orthometric surface acoustic wave device with AlN/metal/Si multilayer structure for sensing strain at very high temperature[J],2021,333(无):113298. |
| APA | Fanbing Hu；Lina Cheng；Shuyao Fan；Xufeng；Yong Liang；Minghui Liu；Wen Wang.(2021).Chip-level orthometric surface acoustic wave device with AlN/metal/Si multilayer structure for sensing strain at very high temperature.,333(无),113298. |
| MLA | Fanbing Hu；Lina Cheng；Shuyao Fan；Xufeng；Yong Liang；Minghui Liu；Wen Wang."Chip-level orthometric surface acoustic wave device with AlN/metal/Si multilayer structure for sensing strain at very high temperature".333.无(2021):113298. |
入库方式： OAI收割
来源：声学研究所
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