Surface morphology and microstructure of the hole sidewall during drilling of Polyether-Ether-Ketone(PEEK) via single-pulse laser
文献类型：期刊论文
| 作者 | Zhang YM(张艳梅)1,3; Li SX(李少霞)1,3 ; Yu YC(于玉翠)1,3; Tian CX(田崇鑫)1,3; Li ZY(李志永)1,3; Zhang Y(张越)1,3; He XL(何秀丽)1,3; Yu G(虞钢)1,2,3
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| 刊名 | JOURNAL OF MANUFACTURING PROCESSES
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| 出版日期 | 2022-11-01 |
| 卷号 | 83页码:488-501 |
| 关键词 | Single -pulse laser drilling Polyether -ether -ketone (PEEK) Surface morphology Microstructure Material -removal mechanism |
| ISSN号 | 1526-6125 |
| DOI | 10.1016/j.jmapro.2022.09.023 |
| 通讯作者 | He, Xiuli(xlhe@imech.ac.cn) ; Yu, Gang(gyu@imech.ac.cn) |
| 英文摘要 | Polyether-ether-ketone (PEEK), as one kind of thermoplastic polymers, exhibits a great deal of remarkable properties and plays an important role in aerospace, electronics, automotive and medicine. An investigation of single-pulse laser drilling on Polyether-ether-ketone (PEEK) was reported to show the influence of irradiation energy on the hole sidewall. In-situ evolution of drilling process was observed by the high-speed camera. The surface morphology and microstructural characteristics of the hole sidewall were evaluated by different char-acterization techniques. The hole sidewall was divided into three parts: expanded zone at the entrance, linear zone in the middle, and U-shaped zone at the bottom. It was found that the quality of inner sidewall could be obviously improved under high single-pulse energy (>1 J), in terms of the surface morphology with small heat -affected zone (HAZ) thickness and surface roughness, as well as the least adhesion. Besides, chemical and structural characteristics of the hole sidewall changed a lot under high energy. The C content of three parts increased as the energy increased. The crystallinity of the hole sidewall decreased from 35 % to 25 % after laser -energy irradiation, but there was little change under different single-pulse energy. New diffraction peaks appeared in X-ray diffraction images and the intensity of the relative peaks in Raman spectra decreased when the energy was over 1 J. It was proven that some chemical bonds (phenyl ring (1597 cm-1) and C-O-C (1148 cm-1)) would break under high energy, contributing to mass removal of the keyhole. Moreover, the HAZ thickness of the hole sidewall was calculated based on a viscous flow model, which showed a good consistency with experimental results. These results reveal material-removal mechanism accompanying the appearance of direct decomposition of the material and breaking of chemical bonds under high energy. It can provide references for understanding mechanisms of HAZ formation and material-removal and improving surface quality for laser drilling of polymers. |
| 分类号 | 二类 |
| WOS关键词 | PROCESS PARAMETERS ; ABLATION ; POLYIMIDE ; CO2-LASER ; REMOVAL ; PEEK |
| 资助项目 | National Natural Science Foundation of China ; Plan for Beijing Municipal Commission of Science and Technology ; [11672304] ; [Z181100003818015] |
| WOS研究方向 | Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000870691200002 |
| 资助机构 | National Natural Science Foundation of China ; Plan for Beijing Municipal Commission of Science and Technology |
| 其他责任者 | He, Xiuli ; Yu, Gang |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/90480]  |
| 专题 | 宽域飞行工程科学与应用中心 |
| 作者单位 | 1.Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China 2.Univ Chinese Acad Sci, Ctr Mat Sci & Optoelect Engn, Beijing 100049, Peoples R China; 3.Chinese Acad Sci, Inst Mech, Beijing 100190, Peoples R China; |
| 推荐引用方式 GB/T 7714 | Zhang YM,Li SX,Yu YC,et al. Surface morphology and microstructure of the hole sidewall during drilling of Polyether-Ether-Ketone(PEEK) via single-pulse laser[J]. JOURNAL OF MANUFACTURING PROCESSES,2022,83:488-501. |
| APA | 张艳梅.,李少霞.,于玉翠.,田崇鑫.,李志永.,...&虞钢.(2022).Surface morphology and microstructure of the hole sidewall during drilling of Polyether-Ether-Ketone(PEEK) via single-pulse laser.JOURNAL OF MANUFACTURING PROCESSES,83,488-501. |
| MLA | 张艳梅,et al."Surface morphology and microstructure of the hole sidewall during drilling of Polyether-Ether-Ketone(PEEK) via single-pulse laser".JOURNAL OF MANUFACTURING PROCESSES 83(2022):488-501. |
入库方式： OAI收割
来源：力学研究所
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