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Pea-Pod-like Carbon Microspheres Encapsulated by Graphene-like Carbon Nitride for Enhanced Thermal Conductivity in Polyimide Films

文献类型：期刊论文

作者Liu, Shuaishuai1,2,3; Wang, Yanyan1,2; Xiao, Chao1,2; Jiang, Miao1,2; Ding, Xin1,2; Zhang, Hui3; Zheng, Kang1,2; Chen, Lin1,2; Tian, Xingyou1,2; Zhang, Xian1,2
刊名ACS APPLIED POLYMER MATERIALS
出版日期2022-08-26
ISSN号2637-6105
关键词g-C3N4 PI film thermal conductivity electrical insulation casting
DOI10.1021/acsapm.2c00929
通讯作者Wang, Yanyan(wangyy@issp.ac.cn) ; Zhang, Hui(zhhui@ahu.edu.cn) ; Zhang, Xian(xzhang@issp.ac.cn)
英文摘要Owing to superior comprehensive performance, polyimide film (PI) has been extensively used as flexible substrate to support and fix electronic components. However, the current PI film has inferior thermal conductivity, especially in the vertical direction, causing failure of electronic devices in overheating conditions. Herein, an electrically insulating pea-pod-like filler with high thermal conductivity in both horizontal and vertical directions was prepared by encapsulating interconnected carbon microsphere (CM) with graphene-like carbon nitride (g-C3N4). The resultant thermal conductivity of PI film in horizontal and vertical directions has been improved by 11 (1.98 W m(-1) K-1) and 2.4 (0.43 W m(-1) K-1) times at 30 wt % CM@g-C3N4 loading, respectively. Furthermore, benefiting from satisfactory light absorption of CM@g-C3N4, the PI/CM@g-C3N4 film displays rapid heating capability under illumination. Meanwhile, the PI/CM@g-C3N4 film keeps intrinsic electrical insulation, thermal and dimensional stabilities. This work provides an effective method to solve the bottleneck of the current PI film in inadequate thermal conductivity.
WOS关键词COMPOSITES ; EFFICIENT ; G-C3N4 ; BN
资助项目National Natural Science Foundation of China[U21A2094] ; CASHIPS Director?s Fund[YZJJZX202015] ; Anhui Province Postdoc-toral Researcher Research Project[E24F0D27]
WOS研究方向Materials Science ; Polymer Science
语种英语
出版者AMER CHEMICAL SOC
WOS记录号WOS:000849219300001
资助机构National Natural Science Foundation of China ; CASHIPS Director?s Fund ; Anhui Province Postdoc-toral Researcher Research Project
源URL[http://ir.hfcas.ac.cn:8080/handle/334002/131896]  
专题中国科学院合肥物质科学研究院
通讯作者Wang, Yanyan; Zhang, Hui; Zhang, Xian
作者单位1.Chinese Acad Sci, Key Lab Photovolta & Energy Conservat Mat, Hefei 230088, Peoples R China
2.Chinese Acad Sci, Inst Solid State Phys, Hefei Inst Phys Sci, Hefei 230031, Peoples R China
3.Anhui Univ, Sch Mat Sci & Engn, Hefei 230601, Peoples R China
推荐引用方式
GB/T 7714		 Liu, Shuaishuai,Wang, Yanyan,Xiao, Chao,et al. Pea-Pod-like Carbon Microspheres Encapsulated by Graphene-like Carbon Nitride for Enhanced Thermal Conductivity in Polyimide Films[J]. ACS APPLIED POLYMER MATERIALS,2022.
APA Liu, Shuaishuai.,Wang, Yanyan.,Xiao, Chao.,Jiang, Miao.,Ding, Xin.,...&Zhang, Xian.(2022).Pea-Pod-like Carbon Microspheres Encapsulated by Graphene-like Carbon Nitride for Enhanced Thermal Conductivity in Polyimide Films.ACS APPLIED POLYMER MATERIALS.
MLA Liu, Shuaishuai,et al."Pea-Pod-like Carbon Microspheres Encapsulated by Graphene-like Carbon Nitride for Enhanced Thermal Conductivity in Polyimide Films".ACS APPLIED POLYMER MATERIALS (2022).

入库方式： OAI收割

来源：合肥物质科学研究院

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