Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating
文献类型：期刊论文
| 作者 | Guanqun Hu3,4; Rui Huang2; Hongli Wang1; Qiuping Zhao3; Xingkai Zhang4
|
| 刊名 | Journal of Solid State Electrochemistry
 |
| 出版日期 | 2022-04-19 |
| 期号 | 26页码:1313–1322 |
| 语种 | 英语 |
| 源URL | [http://ir.licp.cn/handle/362003/29660]  |
| 专题 | 兰州化学物理研究所_先进润滑与防护材料研究发展中心 |
| 通讯作者 | Xingkai Zhang |
| 作者单位 | 1.State Key Laboratory for Oxo Synthesis and Selective Oxidation, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences 2.College of Physics and Electronic Engineering, Northwest Normal University 3.College of Petrochemical Technology, Lanzhou University of Technology 4.Key Laboratory of Science and Technology On Wear and Protection of Materials, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences |
| 推荐引用方式 GB/T 7714 | Guanqun Hu,Rui Huang,Hongli Wang,et al. Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating[J]. Journal of Solid State Electrochemistry,2022(26):1313–1322. |
| APA | Guanqun Hu,Rui Huang,Hongli Wang,Qiuping Zhao,&Xingkai Zhang.(2022).Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating.Journal of Solid State Electrochemistry(26),1313–1322. |
| MLA | Guanqun Hu,et al."Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating".Journal of Solid State Electrochemistry .26(2022):1313–1322. |
入库方式： OAI收割
来源：兰州化学物理研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。