Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint
文献类型：期刊论文
| 作者 | Zhang, Sinan1; Wang, Zhen2; Wang, Jie3; Duan, Guihua2; Li, Haixia4 |
| 刊名 | MATERIALS
 |
| 出版日期 | 2022-07-01 |
| 卷号 | 15期号:14页码:20 |
| 关键词 | Cu/SAC305/Cu solder joints in situ tensile test fracture analysis X-ray mu-CT FE simulation |
| DOI | 10.3390/ma15144756 |
| 英文摘要 | The fracture behavior of the Cu/Sn-3.0Ag-0.5Sn (SAC305)/Cu solder joint was investigated by conducting tensile tests with in situ X-ray micro-computed tomography (mu-CT) observation, and finite element (FE) simulation. The tensile fracture process of solder joints with a real internal defect structure was simulated and compared with the experimental results in terms of defect distribution and fracture path. Additionally, the stress distribution around the defects during the tensile process was calculated. The experimental results reveal that the pores near the intermetallic compound (IMC) layers and the flaky cracks inside the solder significantly affected the crack path. The aggregation degree of the spherical pores and the angle between the crack surface and the loading direction controlled the initiation position and propagation path of the cracks. The fracture morphology indicates that the fracture of the IMC layer was brittle, while the solder fracture exhibited ductile tearing. There are significant differences in the fracture morphology under tensile and shear loading. |
| WOS关键词 | VOID MORPHOLOGY ; SIZE ; DEFORMATION ; INTERFACE ; EVOLUTION ; TEMPERATURE ; SIMULATION ; STRENGTH ; FATIGUE |
| 资助项目 | National Natural Science Foundation of China[12172367] |
| WOS研究方向 | Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering ; Physics |
| 语种 | 英语 |
| 出版者 | MDPI |
| WOS记录号 | WOS:000832281200001 |
| 资助机构 | National Natural Science Foundation of China |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/54328]  |
| 专题 | 中国科学院过程工程研究所 |
| 通讯作者 | Wang, Zhen |
| 作者单位 | 1.Lanzhou Univ, Sch Phys Sci & Technol, Lanzhou 730000, Peoples R China 2.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech LNM, Beijing 100190, Peoples R China 3.Tsinghua Univ, Dept Engn Mech, Beijing 100084, Peoples R China 4.Chinese Acad Sci, Inst Proc Engn, Beijing 100190, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhang, Sinan,Wang, Zhen,Wang, Jie,et al. Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint[J]. MATERIALS,2022,15(14):20. |
| APA | Zhang, Sinan,Wang, Zhen,Wang, Jie,Duan, Guihua,&Li, Haixia.(2022).Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint.MATERIALS,15(14),20. |
| MLA | Zhang, Sinan,et al."Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint".MATERIALS 15.14(2022):20. |
入库方式： OAI收割
来源：过程工程研究所
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