Exploring three-point-bending fracture toughness of thick diamond films from different directions
文献类型：期刊论文
| 作者 | An, Kang1,2,5; Liu, Peng5; Shao, Siwu5; Li, Haixia3; Yang, Zhiliang5; Zhang, Shuai5; Li, Shiyu5; Huang, Yabo5; Liu, Jinlong2,5; Chen, Liangxian5 |
| 刊名 | SURFACE & COATINGS TECHNOLOGY
 |
| 出版日期 | 2022-10-25 |
| 卷号 | 448页码:10 |
| 关键词 | Thick diamond film Fracture toughness DC arc plasma jet CVD Columnar grain Defects |
| ISSN号 | 0257-8972 |
| DOI | 10.1016/j.surfcoat.2022.128888 |
| 英文摘要 | In this study, the effect of defects on fracture toughness in different directions was investigated. Two diamond films with a diameter of 122 mm and as-deposited thicknesses of 2.2 and 1.5 mm, respectively, were deposited by DC arc plasma jet chemical vapor deposition. To accurately obtain the fracture toughness, the films were ground and polished to 1.6 and 0.8 mm, respectively. The results indicate that many defects, including pores, are introduced into the films during the growth process, particularly on the side close to the growth surface in thicker film. The size of pores reaches micrometres, which affects the fracture toughness under loading in different directions. Due to the minimum grain size, both films exhibit a maximum toughness of 8.2 and 10.0 MPa.m(1/2), respectively, with growth-surface cracks. For the thinner sample, the maximum value is followed by that of the edge-surface cracks. As the grain size of the edge surface falls between that of the growth surface and that of the nucleation surface, the results indicate that fracture toughness is affected by grain size. However, the number of pores near the growth side increases when the thickness exceeds 0.8 mm. Pores reduce the toughness, resulting in the minimum fracture toughness (6 MPa.m(1/2)) of the thicker diamond film with edge-surface laser cracks. The sample with an edge-surface sharp pre-crack has a similar fracture toughness of 5.6 MPa.m(1/2). This study provides guidance for selecting the applied load direction. |
| WOS关键词 | CVD DIAMOND ; ACCURATE MEASUREMENT ; DC ; BEHAVIOR ; PLATES |
| 资助项目 | National Key Research and Devel-opment Program ; National Natural Science Foundation of China ; Postdoc Research Foundation of Shunde Graduate School at the Uni-versity of Science and Technology Beijing ; Fundamental Research Funds for the Central Universities ; [2019YFE03100200] ; [52102034] ; [2020BH015] ; [FRF-MP-20-48] |
| WOS研究方向 | Materials Science ; Physics |
| 语种 | 英语 |
| WOS记录号 | WOS:000863516600001 |
| 出版者 | ELSEVIER SCIENCE SA |
| 资助机构 | National Key Research and Devel-opment Program ; National Natural Science Foundation of China ; Postdoc Research Foundation of Shunde Graduate School at the Uni-versity of Science and Technology Beijing ; Fundamental Research Funds for the Central Universities |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/55090]  |
| 专题 | 中国科学院过程工程研究所 |
| 通讯作者 | An, Kang; Li, Chengming |
| 作者单位 | 1.North China Univ Technol, Sch Mech & Mat Engn, Beijing 100144, Peoples R China 2.Univ Sci & Technol Beijing, Shunde Innovat Sch, Foshan 528399, Peoples R China 3.Chinese Acad Sci, Inst Proc Engn, Beijing 100190, Peoples R China 4.Univ Sci & Technol Beijing, State Key Lab Adv Met, Beijing 100083, Peoples R China 5.Univ Sci & Technol Beijing, Inst Adv Mat & Technol, Beijing 100083, Peoples R China |
| 推荐引用方式 GB/T 7714 | An, Kang,Liu, Peng,Shao, Siwu,et al. Exploring three-point-bending fracture toughness of thick diamond films from different directions[J]. SURFACE & COATINGS TECHNOLOGY,2022,448:10. |
| APA | An, Kang.,Liu, Peng.,Shao, Siwu.,Li, Haixia.,Yang, Zhiliang.,...&Li, Chengming.(2022).Exploring three-point-bending fracture toughness of thick diamond films from different directions.SURFACE & COATINGS TECHNOLOGY,448,10. |
| MLA | An, Kang,et al."Exploring three-point-bending fracture toughness of thick diamond films from different directions".SURFACE & COATINGS TECHNOLOGY 448(2022):10. |
入库方式： OAI收割
来源：过程工程研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。