A hierarchically encapsulated phase-change film with multi-stage heat management properties and conformable self-interfacing contacts for enhanced interface heat dissipation
文献类型：期刊论文
| 作者 | Lu, Qing1,3; Wang, Xiang1; Zhao, Hong-wei2; Wang, Xun-rui1,3; Zhao, Jia-qing3; Kong, Hao-ran1; Wang, Tao3; Liang, Chao3; Li, Jin-hong3; Xu, Wayne Qiang4 |
| 刊名 | JOURNAL OF MATERIALS CHEMISTRY A
 |
| 出版日期 | 2022-10-17 |
| 页码 | 13 |
| ISSN号 | 2050-7488 |
| DOI | 10.1039/d2ta05582a |
| 英文摘要 | With the rapid evolution of power and packing densities of microelectronic and energy storage devices, timely heat dissipation towards an instantaneous high intensity heat flow is becoming increasingly significant to maintain system reliability. A highly thermally conductive solid-liquid phase change film can be a potential candidate for the next-generation heat dissipation material by coupling the efficient heat storage and self-softening properties during its isothermal phase transition process. Herein, a porous phase change film composed of high enthalpy paraffin microcapsules (213.7 J g(-1)), impregnated with an n-docosane and nano-Si3N4 mixture, is shown to be an ideal phase change thermal interface material (PhC-TIM). The hierarchically encapsulated structures, with two-stage thermal management properties, guarantee temperature control of electronic devices by storage of instantaneous excessive heat, without degradation of thermal conductivity (3.8 W m(-1) K-1) after 500 heating-cooling cycles. Furthermore, the presented PhC-TIM demonstrates ultra-flexibility in the working state, which can form tight interface contact and results in low thermal contact resistance. The hot-spot temperatures of a light-emitting diode (LED) chip and a lithium-ion battery module equipped with the HEPCF were decreased by 15 degrees C and 20 degrees C, respectively. The obtained results open opportunities for PhC-TIMs as efficient thermal dissipation materials for electronics cooling and suppressing thermal runaway in energy storage devices. |
| WOS关键词 | THERMAL-CONDUCTIVITY ; ENERGY STORAGE ; COMPOSITES ; TEMPERATURE ; PERFORMANCE ; GENERATION ; RESISTANCE ; BATTERIES ; NITRIDE ; LIQUID |
| 资助项目 | National Natural Science Foundation of China[22105206] ; Joint Youth Research Program of Guangdong Province, China[2019A1515110185] |
| WOS研究方向 | Chemistry ; Energy & Fuels ; Materials Science |
| 语种 | 英语 |
| 出版者 | ROYAL SOC CHEMISTRY |
| WOS记录号 | WOS:000877657600001 |
| 资助机构 | National Natural Science Foundation of China ; Joint Youth Research Program of Guangdong Province, China |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/55430]  |
| 专题 | 中国科学院过程工程研究所 |
| 通讯作者 | Wang, Xiang; Li, Jin-hong; Xu, Wayne Qiang |
| 作者单位 | 1.Chinese Acad Sci, Inst Proc Engn, State Key Lab Multiphase Complex Syst, Beijing 100190, Peoples R China 2.Chinese Acad Sci, Tech Inst Phys & Chem, Key Lab Cryogen, Beijing 100190, Peoples R China 3.China Univ Geosci, Sch Mat Sci & Technol, Beijing Key Lab Mat Utilizat Nonmetall Minerals &, Natl Lab Mineral Mat, Beijing 100083, Peoples R China 4.Forward Ind Res Inst, Shenzhen 518000, Peoples R China |
| 推荐引用方式 GB/T 7714 | Lu, Qing,Wang, Xiang,Zhao, Hong-wei,et al. A hierarchically encapsulated phase-change film with multi-stage heat management properties and conformable self-interfacing contacts for enhanced interface heat dissipation[J]. JOURNAL OF MATERIALS CHEMISTRY A,2022:13. |
| APA | Lu, Qing.,Wang, Xiang.,Zhao, Hong-wei.,Wang, Xun-rui.,Zhao, Jia-qing.,...&Xu, Wayne Qiang.(2022).A hierarchically encapsulated phase-change film with multi-stage heat management properties and conformable self-interfacing contacts for enhanced interface heat dissipation.JOURNAL OF MATERIALS CHEMISTRY A,13. |
| MLA | Lu, Qing,et al."A hierarchically encapsulated phase-change film with multi-stage heat management properties and conformable self-interfacing contacts for enhanced interface heat dissipation".JOURNAL OF MATERIALS CHEMISTRY A (2022):13. |
入库方式： OAI收割
来源：过程工程研究所
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