Influence of Package Structure on the Performance of the Single Emitter Diode Laser
文献类型：期刊论文
| 作者 | Li, Xiaoning1,2; Zhang, Yanxin1,3; Wang, Jingwei1,3; Xiong, Lingling1,3; Zhang, Pu1,3 ; Nie, Zhiqiang1,3; Wang, Zhenfu1,3; Liu, Hui1,3; Liu, Xingsheng1,3
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| 刊名 | ieee transactions on components packaging and manufacturing technology
 |
| 出版日期 | 2012-10-01 |
| 卷号 | 2期号:10页码:1592-1599 |
| 关键词 | Component architectures semiconductor device packaging |
| ISSN号 | 2156-3950 |
| 产权排序 | 1 |
| 合作状况 | 国内 |
| 英文摘要 | the package structure critically influences the major characteristics of semiconductor lasers, such as thermal behavior, output power, wavelength, and far-field distribution. in this paper, a new single emitter package structure called f-mount is designed and compared with the conventional package structure c-mount. the influence of package structure on their performances is characterized and analyzed. the thermal resistances of lasers with different package structures are calculated through simulation, and are contrasted with experimental results. some devices are also tested for the maximum output power level. under the continuous wave (cw) condition, the maximum power of f-mount reaches 12.6 w at 808 nm while the output power only reaches 10.9 w for c-mount. under the condition of 0.5% duty cycle (100 mu s, 50 hz), the catastrophic optical mirror damage level reaches 58.7 w at 74 a for f-mount, and 54.8 w at 57 a for c-mount are reported for the first time. it is experimentally found that there is an obvious wavelength difference between the two type structure lasers: about 1.37 nm in cw mode and 2.89 nm in quasi cw mode. theoretical analysis shows that red-shift and blue-shift is a result of external strain in the package process of f-mount and c-mount, respectively. it is also found that the package structure has an effect on the divergence angle of slow axis far fields, but little impact on that of fast axis far fields. the analysis shows that package structure has a strong influence on the performance of the laser; therefore, the package should be optimized to achieve better performance for some special applications. |
| WOS标题词 | science & technology ; technology |
| 类目[WOS] | engineering, manufacturing ; engineering, electrical & electronic ; materials science, multidisciplinary |
| 研究领域[WOS] | engineering ; materials science |
| 关键词[WOS] | power semiconductor-lasers ; indium ; strain |
| 收录类别 | SCI ; EI |
| 语种 | 英语 |
| WOS记录号 | WOS:000309729400004 |
| 公开日期 | 2013-10-09 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/20937]  |
| 专题 | 西安光学精密机械研究所_炬光科技有限公司 |
| 作者单位 | 1.Chinese Acad Sci, Xian Inst Opt & Precis Mech, Xian 710119, Peoples R China 2.Xi An Jiao Tong Univ, Xian 710049, Peoples R China 3.Xian Focuslight Technol Co Ltd, Xian 710119, Peoples R China |
| 推荐引用方式 GB/T 7714 | Li, Xiaoning,Zhang, Yanxin,Wang, Jingwei,et al. Influence of Package Structure on the Performance of the Single Emitter Diode Laser[J]. ieee transactions on components packaging and manufacturing technology,2012,2(10):1592-1599. |
| APA | Li, Xiaoning.,Zhang, Yanxin.,Wang, Jingwei.,Xiong, Lingling.,Zhang, Pu.,...&Liu, Xingsheng.(2012).Influence of Package Structure on the Performance of the Single Emitter Diode Laser.ieee transactions on components packaging and manufacturing technology,2(10),1592-1599. |
| MLA | Li, Xiaoning,et al."Influence of Package Structure on the Performance of the Single Emitter Diode Laser".ieee transactions on components packaging and manufacturing technology 2.10(2012):1592-1599. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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