中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

文献类型:期刊论文

作者Xu, Linmeng1,2,3; Zhao, Wanying3; Li, Junhui3
刊名JOURNAL OF ELECTRONIC PACKAGING
出版日期2023-09-01
卷号145期号:3
ISSN号1043-7398;1528-9044
关键词air cooling finite element analysis heat conduction model control parameter optimization
DOI10.1115/1.4062530
产权排序1
英文摘要

Chip junction temperature is a key factor affecting the normal operation of the chip. The development of integrated circuit technology brings about high integration and low cost, but it also puts forward higher requirements for the cooling system. This paper focuses on the air cooling of the chip, builds a hardware test platform based on MCS-52, the general name of the intel series microcontroller unit, and sets up a mathematical model of the air cooling process of the chip on the matlab platform based on the principle of energy conservation, heat transfer theory and finite element method. By proposing the equivalent convective heat transfer coefficient, the thermal resistance of the system can be well estimated. This model can easily realize the joint simulation of chip, heat radiator, and control strategy, which overcomes the disadvantage that traditional finite element simulation software are difficult to combine with control strategy. In addition, based on the model, the proportional integral differential (PID) control parameters are automatically optimized, achieving excellent temperature control effect, and proving the feasibility of optimizing the control parameters through the model.

语种英语
出版者ASME
WOS记录号WOS:001035262500013
源URL[http://ir.opt.ac.cn/handle/181661/96711]  
专题条纹相机工程中心
通讯作者Li, Junhui
作者单位1.Univ Chinese Acad Sci, Beijing 100049, Peoples R China
2.Chinese Acad Sci, Xian Inst Opt & Precis Mech, Xian 710119, Peoples R China
3.Cent South Univ, Sch Mech & Elect Engn, State Key Lab High Performance Complex Mfg, Changsha 410083, Peoples R China
推荐引用方式
GB/T 7714
Xu, Linmeng,Zhao, Wanying,Li, Junhui. Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning[J]. JOURNAL OF ELECTRONIC PACKAGING,2023,145(3).
APA Xu, Linmeng,Zhao, Wanying,&Li, Junhui.(2023).Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning.JOURNAL OF ELECTRONIC PACKAGING,145(3).
MLA Xu, Linmeng,et al."Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning".JOURNAL OF ELECTRONIC PACKAGING 145.3(2023).

入库方式: OAI收割

来源:西安光学精密机械研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。