Influence of polyethylene glycol inhibitors on properties of electroplated copper layer
文献类型：期刊论文
| 作者 | Xiang,Jing1,2; Qin,Ziwei1; Zhang,Hongzhi1; Qin,Renhua1; Zeng,Chong1,2; Zhou,Dengmei1; Li,Jie1; Wan,Xiaoting1; Song,Jing3; Tian,Liangliang1 |
| 刊名 | Journal of Physics: Conference Series
 |
| 出版日期 | 2022-12-01 |
| 卷号 | 2393期号:1 |
| ISSN号 | 1742-6588 |
| DOI | 10.1088/1742-6596/2393/1/012036 |
| 英文摘要 | Abstract Inhibitor is one of the important additive components in electrodeposited copper. As a common inhibitor, the concentration of PEG8000 has an important effect on electrodeposited copper. In this article, different concentrations of polyethylene glycol-based organic additives were added to the acidic electrolyte, and their effects on the electrochemical behavior of copper electrodeposition were investigated by galvanostatic test, cathodic polarization curve test, and cyclic voltammetry test. In addition, the surface morphology and crystallographic orientation of the obtained copper layers were analyzed by SEM and XRD. The results show that with the increase of PEG8000 concentration in the electroplating solution system, the inhibitory effect of PEG8000 on electroplating copper becomes stronger, and the copper surface density obtained by electroplating is better. |
| 语种 | 英语 |
| 出版者 | IOP Publishing |
| WOS记录号 | IOP:JPCS_2393_1_012036 |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/56605]  |
| 作者单位 | 1.School of Electronic Information and Electrical Engineering, Chongqing University of Arts and Sciences, Chongqing, 402160, China 2.Postdoctoral Research Station, China Silian Instrument Group Co., Ltd, 400707, China 3.National Engineering Research Center of green recycling for strategic metal resources, Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, China |
| 推荐引用方式 GB/T 7714 | Xiang,Jing,Qin,Ziwei,Zhang,Hongzhi,et al. Influence of polyethylene glycol inhibitors on properties of electroplated copper layer[J]. Journal of Physics: Conference Series,2022,2393(1). |
| APA | Xiang,Jing.,Qin,Ziwei.,Zhang,Hongzhi.,Qin,Renhua.,Zeng,Chong.,...&Tian,Liangliang.(2022).Influence of polyethylene glycol inhibitors on properties of electroplated copper layer.Journal of Physics: Conference Series,2393(1). |
| MLA | Xiang,Jing,et al."Influence of polyethylene glycol inhibitors on properties of electroplated copper layer".Journal of Physics: Conference Series 2393.1(2022). |
入库方式： OAI收割
来源：过程工程研究所
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