Cooling rate and microstructural investigation of rapidly solidified spherical mono-sized copper particles
文献类型：会议论文
| 作者 | Hu, Ying-Yan1,2; Wang, Jun-Feng2; Li, Can2,3; Gao, Yi-Ying2; Li, Jian-Qiang2,4 |
| 出版日期 | 1905-07-12 |
| 会议日期 | July 18, 2019 - July 21, 2019 |
| 会议地点 | Chongqing, China |
| 关键词 | Rapid solidification - Cooling - Argon - Copper - Grain size and shape - Particle size - Drops - Spheres |
| 卷号 | 976 MSF |
| DOI | 10.4028/www.scientific.net/MSF.976.42 |
| 页码 | 42-49 |
| 英文摘要 | Spherical copper particles with diameter ranging from 120.6 to 437.0 渭m were prepared by the pulsated orifice ejection method (termed 'POEM'). These spherical copper particles exhibit a good spherical shape and a narrow size distribution, suggesting that the liquid copper can completely break the balance between the surface tension and the liquid static pressure in the crucible micropores and accurately control the volume of the droplets. Furthermore, the relationship between cooling rate and microstructures of spherical copper particles was carried out with a specific focus on different cooling atmosphere and particle diameter during the rapid solidification. The cooling rate of spherical copper particles is evaluated by a Newton鈥檚 cooling model. It is revealed that the cooling rate was depended on cooling medium and particle diameter. The cooling rate decreases and the grain size increases with the increase of particle diameter during the rapid solidification, while the grain boundary of same particle diameter with larger cooling rate in argon gas is smaller, while the grain boundary of particles with smaller cooling rate in helium gas is larger. When the particle diameter is larger than 100 渭m, the cooling rate of the cooper droplet in argon gas achieves 1.0脳104 K/s. Meanwhile, the cooling rate decreases rapidly when the particle diameter increased between 70.6 and 149.6 渭m. It is an effective route for fabrication of high-quality spherical copper particles. 漏 2020 Trans Tech Publications Ltd, Switzerland. |
| 项目编号 | This work was financially supported by the Instrument Developing Project of the Chinese Academy of Sciences (Grant No. YZ201520) and State Natural Sciences Foundation (No.51501179, No.51674232 and No.51671181). |
| 资助机构 | Trans Tech Publications Ltd |
| 会议录 | 3rd International Conference on Material Engineering and Manufacturing, ICMEM 2019 and 4th International Conference on Materials Engineering and Nanotechnology, ICMEN 2019
 |
| 学科主题 | Grain Boundaries |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/59283]  |
| 作者单位 | 1.School of Engineering and Technology, China University of Geosciences, Beijing, China 2.National Engineering Laboratory for Hydrometallurgical Cleaner Production Technology, Key Laboratory of Green Process and Engineering, Institute of Process Engineering, Chinese Academy of Sciences, Beijing, China 3.School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, China 4.School of Chemistry and Chemical Engineering, University of Chinese Academy of Sciences, Beijing, China |
| 推荐引用方式 GB/T 7714 | Hu, Ying-Yan,Wang, Jun-Feng,Li, Can,et al. Cooling rate and microstructural investigation of rapidly solidified spherical mono-sized copper particles[C]. 见:. Chongqing, China. July 18, 2019 - July 21, 2019. |
入库方式： OAI收割
来源：过程工程研究所
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