Fabrication of highly reliable joint based on Cu/Ni/Sn double-layer powder for high temperature application
文献类型：会议论文
| 作者 | Xu, Hongyan2,3; Shen, Yaochun1; Hu, Yihua1; Li, Jianqiang3,4; Xu, Ju2,3 |
| 出版日期 | 2019-10-01 |
| 关键词 | Powder metals - Nickel coatings - Morphology - Fabrication |
| 卷号 | 16 |
| 期号 | 4 |
| DOI | 10.4071/IMAPS.960671 |
| 页码 | 188-195 |
| 英文摘要 | A highly reliable three-dimensional network structure joint was fabricated based on Cu/Ni/Sn powder with double-layer coatings and transient liquid phase bonding (TLPB) technology for high temperature application. The Cu/Ni/Sn joint is characterized by Cu metal particles embedded in the matrix of (Cu,Ni)6Sn5/Ni3Sn4 intermetallic compounds (IMCs), with a low void ratio, and can be reflowed at low temperatures (6Sn5/ Ni3Sn4 IMCs, and the Cu/Ni/Sn joint had a lower void ratio and a higher shear strength than those of Cu/Sn. The mechanism of the Ni-coating layer inhibiting phase transformation was studied. The high reliable three-dimensional network structure joint based on Cu/Ni/Sn double-layer powder was fabricated for high temperature application. Copyright 漏 International Microelectronics Assembly and Packaging Society |
| 项目编号 | This work was supported by the National Nature Science Foundation of China under Grant No. 51777203 and the National key research & develop plan New energy vehicles special project" (20 16YFBO 100600)." |
| 资助机构 | IMAPS-International Microelectronics and Packaging Society |
| 学科主题 | High Temperature Applications |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/59313]  |
| 作者单位 | 1.School of Electrical Engineering, Electronics and Computer Science, University of Liverpool, Brownlow Hill, Liverpool; L69 3GJ, United Kingdom 2.Beijing Engineering Laboratory of Electrical Drive System and Power Electronic Device Packaging Technology, Micro-Nano Fabrication Technology Department, Institute of Electronic Engineering, Chinese Academy of Sciences, Beijing; 100190, China 3.University of Chinese Academy of Sciences, Beijing; 100049, China 4.State Key Laboratory of Multiphase Complex System, Institute of Process Engineering, Chinese Academy of Sciences, Beijing; 100190, China |
| 推荐引用方式 GB/T 7714 | Xu, Hongyan,Shen, Yaochun,Hu, Yihua,et al. Fabrication of highly reliable joint based on Cu/Ni/Sn double-layer powder for high temperature application[C]. 见:. |
入库方式： OAI收割
来源：过程工程研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。