Influence of polyethylene glycol inhibitors on properties of electroplated copper layer
文献类型：会议论文
| 作者 | Xiang, Jing2,3; Qin, Ziwei2; Zhang, Hongzhi2; Qin, Renhua2; Zeng, Chong2,3; Zhou, Dengmei2; Li, Jie2; Wan, Xiaoting2; Song, Jing1; Tian, Liangliang2 |
| 出版日期 | 1905-07-14 |
| 会议日期 | September 16, 2022 - September 18, 2022 |
| 关键词 | Additives - Cathodic polarization - Copper - Cyclic voltammetry - Electrodes - Electrolytes - Polyethylene glycols - Polyethylenes - Surface morphology |
| 卷号 | 2393 |
| 期号 | 1 |
| DOI | 10.1088/1742-6596/2393/1/012036 |
| 英文摘要 | Inhibitor is one of the important additive components in electrodeposited copper. As a common inhibitor, the concentration of PEG8000 has an important effect on electrodeposited copper. In this article, different concentrations of polyethylene glycol-based organic additives were added to the acidic electrolyte, and their effects on the electrochemical behavior of copper electrodeposition were investigated by galvanostatic test, cathodic polarization curve test, and cyclic voltammetry test. In addition, the surface morphology and crystallographic orientation of the obtained copper layers were analyzed by SEM and XRD. The results show that with the increase of PEG8000 concentration in the electroplating solution system, the inhibitory effect of PEG8000 on electroplating copper becomes stronger, and the copper surface density obtained by electroplating is better. 漏 Published under licence by IOP Publishing Ltd. |
| 项目编号 | The authors gratefully acknowledge the support of Natural Science Foundation of Chongqing (cstc2021jcyj?msxmX0271), the Scientific Research Fund of Chongqing Municipal Education Commission (KJQN202101321, HZ2021013, and KJQN202101306), High?level Talents of Chongqing University of Art and Sciences (No. R2019FDQ12, R2020SDQ02, R2019FDQ13). |
| 会议录 | Journal of Physics: Conference Series
 ; 2nd International Conference on Advanced Materials and Chemical Engineering, AMCE 2022
|
| 会议录出版者 | Institute of Physics |
| 学科主题 | Electroplating |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/59627]  |
| 作者单位 | 1.National Engineering Research Center of Green Recycling for Strategic Metal Resources, Institute of Process Engineering, Chinese Academy of Sciences, Beijing; 100190, China 2.School of Electronic Information and Electrical Engineering, Chongqing University of Arts and Sciences, Chongqing; 402160, China 3.Postdoctoral Research Station, China Silian Instrument Group Co., Ltd, 400707, China |
| 推荐引用方式 GB/T 7714 | Xiang, Jing,Qin, Ziwei,Zhang, Hongzhi,et al. Influence of polyethylene glycol inhibitors on properties of electroplated copper layer[C]. 见:. September 16, 2022 - September 18, 2022. |
入库方式： OAI收割
来源：过程工程研究所
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