Fully Integrated Flexible Dielectric Monitoring Sensor System for Real-Time In Situ Prediction of the Degree of Cure and Glass Transition Temperature of an Epoxy Resin
文献类型:期刊论文
作者 | Yang Y(杨阳)1,5![]() |
刊名 | IEEE Transactions on Instrumentation and Measurement
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出版日期 | 2021 |
卷号 | 70页码:6004809 |
关键词 | Cure monitoring dielectric sensor degree of cure fully integrated system glass transition temperature |
ISSN号 | 0018-9456 |
DOI | 10.1109/TIM.2021.3057291 |
通讯作者 | Yang, Yang(yang.yang0513@gmail.com) ; Vanfleteren, Jan(jan.vanfleteren@imec.be) |
目次 | 否 |
英文摘要 | Flexible dielectric sensors received significant interest for real-time in situ cure monitoring of polymeric composites over the past decade. Currently, the state-of-the-art dielectric sensors mainly focus on detecting the distinct stages of the polymeric composite curing process. While low-cost and quantitative monitoring of the thermal, mechanical, and chemical properties of the materials during the cure is of great interest, to date, such a sensor system has not been realized because the existing devices excessively depend on external instrumentations, combined with a lack of an embedded reliable data processing module. Here, a fully integrated dielectric monitoring sensor system (DMS) incorporating dielectric and temperature sensors is developed, capable of monitoring in real-time the temperature, the degree of cure, and the glass transition temperature (T-g) of polymeric composites. An independent characterization of the cure kinetics was performed using differential scanning calorimetry and Raman spectroscopy. These data enabled associating the main physical and chemical transformations in the polymeric materials with particular features observed in the dielectric measurements. We demonstrate the accurate estimation of the degree of cure and T-g of an epoxy resin. The proposed system shows the potential for a new generation of intelligent manufacturing technology of composite materials. |
WOS关键词 | RAMAN-SPECTROSCOPY ; FABRICATION ; DESIGN ; RELAXATION ; DSC |
资助项目 | Flemish Agency for Innovation by Science and Technology (IWT) through the program for Strategic Basic Research (SBO)[120024] ; National Key Research and Development Program of China[2019YFC1408603] |
WOS研究方向 | Engineering ; Instruments & Instrumentation |
语种 | 英语 |
WOS记录号 | WOS:000636274000123 |
出版者 | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
资助机构 | Flemish Agency for Innovation by Science and Technology (IWT) through the program for Strategic Basic Research (SBO) ; National Key Research and Development Program of China |
版本 | 出版稿 |
源URL | [http://ir.idsse.ac.cn/handle/183446/9092] ![]() |
专题 | 深海工程技术部_深海资源开发研究室 |
作者单位 | 1.Univ Ghent, Ctr Microsyst Technol, IMEC, B-9052 Ghent, Belgium 2.Univ Ghent, Dept Mat Text & Chem Engn MaTCh, B-9052 Ghent, Belgium 3.Siemens Garnesa Renewable Energy, DK-9220 Aalborg, Denmark 4.OIP Sensor Syst, B-9700 Oudenaarde, Belgium 5.Institute of Deep-sea Science and Engineering, Chinese Academy of Sciences, Sanya, Hainan, 572000, China |
推荐引用方式 GB/T 7714 | Yang Y,Plovie, B ,Chiesura, G ,et al. Fully Integrated Flexible Dielectric Monitoring Sensor System for Real-Time In Situ Prediction of the Degree of Cure and Glass Transition Temperature of an Epoxy Resin[J]. IEEE Transactions on Instrumentation and Measurement,2021,70:6004809. |
APA | Yang Y,Plovie, B ,Chiesura, G ,Vervust, T ,&Daelemans, L .(2021).Fully Integrated Flexible Dielectric Monitoring Sensor System for Real-Time In Situ Prediction of the Degree of Cure and Glass Transition Temperature of an Epoxy Resin.IEEE Transactions on Instrumentation and Measurement,70,6004809. |
MLA | Yang Y,et al."Fully Integrated Flexible Dielectric Monitoring Sensor System for Real-Time In Situ Prediction of the Degree of Cure and Glass Transition Temperature of an Epoxy Resin".IEEE Transactions on Instrumentation and Measurement 70(2021):6004809. |
入库方式: OAI收割
来源:深海科学与工程研究所
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