Structure and properties of thermoplastic polyimide based on 4', 4'-(Oxybis (methylene)) bis ([1.1'- bipheny]3-amine) diamine
文献类型：期刊论文
| 作者 | Lu, Jinshui2; Zhang, Jinyuan2; Liu, Heng2; Chen, Weipeng2; Luo, Jiangrong2; Wang, Ziqing2; Cui, Tingting2; Min, Yonggang2; Liu, Yidong1 |
| 刊名 | HIGH PERFORMANCE POLYMERS
 |
| 出版日期 | 2023-08-30 |
| 页码 | 10 |
| ISSN号 | 0954-0083 |
| 关键词 | Polyimide glass transition temperatures films thermal properties |
| DOI | 10.1177/09540083231191416 |
| 通讯作者 | Min, Yonggang(ygmin@gdut.edu.cn) ; Liu, Yidong(liuyd@imech.ac.cn) |
| 英文摘要 | In this work, a new diamine was designed by connecting flexible structures such as ether bond and aliphatic carbon chain between benzene rings, and was synthesized and purified through simple reactions such as Suzuki reaction. Finally, a series of polyimide (PI) films were synthesized by copolymerization with 4.4`-diaminodiphenyl ether (ODA)\pyromellitic dianhydride (PMDA) in different proportions. We prepared polyimide films with new monomer copolymerization ratios of 1% (PI-1), 5% (PI-2), 10% (PI-3), and 20% (PI-4). The polyimide films showed excellent glass transition temperatures, which were attributed to their unique bent architectures. The mechanical and thermal properties of the thermosets were studied using tensile testing, static thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). As the results, the films exhibited the optimal glass transition temperatures (317.56 & DEG;C-381.91 & DEG;C), and the component with the highest copolymerization ratio has a 15% decrease in glass transition temperature compared to the component without copolymerization. Moreover, PI-1-PI-4 showed good heat resistance in the N2 atmosphere. The temperatures corresponding to a 5% heat loss in the films (T5%) were 458.12 & DEG;C-548.75 & DEG;C, respectively. |
| WOS关键词 | FREE-VOLUME ; DIFFUSION ; POLYMER ; ETHER |
| 资助项目 | In this section, you can acknowledge any support given which is not covered by the author contribution or funding sections. This may include administrative and technical support, or donations in kind (e.g., materials used for experiments). |
| WOS研究方向 | Polymer Science |
| 语种 | 英语 |
| WOS记录号 | WOS:001069680200001 |
| 资助机构 | In this section, you can acknowledge any support given which is not covered by the author contribution or funding sections. This may include administrative and technical support, or donations in kind (e.g., materials used for experiments). |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/92942]  |
| 专题 | 宽域飞行工程科学与应用中心 |
| 通讯作者 | Min, Yonggang; Liu, Yidong |
| 作者单位 | 1.Chinese Acad Sci, Inst Mech, Beijing 100190, Peoples R China 2.Guangdong Univ Technol, Sch Mat & Energy, Guangzhou 510006, Peoples R China |
| 推荐引用方式 GB/T 7714 | Lu, Jinshui,Zhang, Jinyuan,Liu, Heng,et al. Structure and properties of thermoplastic polyimide based on 4', 4'-(Oxybis (methylene)) bis ([1.1'- bipheny]3-amine) diamine[J]. HIGH PERFORMANCE POLYMERS,2023:10. |
| APA | Lu, Jinshui.,Zhang, Jinyuan.,Liu, Heng.,Chen, Weipeng.,Luo, Jiangrong.,...&Liu, Yidong.(2023).Structure and properties of thermoplastic polyimide based on 4', 4'-(Oxybis (methylene)) bis ([1.1'- bipheny]3-amine) diamine.HIGH PERFORMANCE POLYMERS,10. |
| MLA | Lu, Jinshui,et al."Structure and properties of thermoplastic polyimide based on 4', 4'-(Oxybis (methylene)) bis ([1.1'- bipheny]3-amine) diamine".HIGH PERFORMANCE POLYMERS (2023):10. |
入库方式： OAI收割
来源：力学研究所
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