Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System
文献类型：期刊论文
| 作者 | Zhou Lijun1,5; Wei Song1,2,5; Guo Jingdong1,5; Sun Fangyuan3; Wang Xinwei4; Tang Dawei4 |
| 刊名 | ACTA METALLURGICA SINICA
 |
| 出版日期 | 2022-12-11 |
| 卷号 | 58期号:12页码:1645-1654 |
| 关键词 | femtosecond laser time-domain thermoreflectance intermetallic compounds thermal conductivity |
| ISSN号 | 0412-1961 |
| DOI | 10.11900/0412.1961.2021.00216 |
| 通讯作者 | Guo Jingdong(jdguo@imr.ac.cn) ; Sun Fangyuan(sunfangyuan@ustb.edu.cn) |
| 英文摘要 | An accurate temperature analysis of electronic packaging requires an understanding of the thermal-transport parameters of the material. However, studies on the thermal conductivity of intermetallic compounds (IMCs) in micro-interconnect solder joints are scarce, particularly common IMCs forming in Cu-Sn systems, which seriously affect the precise prediction of the temperature field and thermal stress for electronic packaging structures. This work proposes a novel method to quantitatively measure the thermophysical parameters of Cu-Sn IMCs based on the dual-wavelength femtosecond laser timedomain thermoreflectance (TDTR) system. Cu-Sn diffusion couple samples were prepared using a reflow and aging process. Two layers of Cu6Sn5 and Cu3Sn IMCs formed at the interface with micron thickness, and the (001) crystal plane of Cu6Sn5 was the preferred orientation. The sensitivity of the experimental parameters to the measurement parameters affects the fitting accuracy. Therefore, before testing, the effects of the aluminum transducer thickness and pump laser modulation frequency on the phase signal sensitivity in the thermal conductivity measurements of Cu6Sn5 and Cu3Sn were analyzed to help select the specific experimental parameters. After testing, the thermal conductivities of Cu6Sn5 and Cu3Sn were 47.4 and 87.6 W/(m center dot K), respectively, which are slightly higher than the previous results because of the microstructure discrepancy caused by different material preparation techniques. Finally, the influence of the pump laser diameter, aluminum transducer thickness, and material specific heat on the measurement error of thermal conductivity for Cu6Sn5 and Cu3Sn was examined. The test errors of the Cu6Sn5 and Cu3Sn thermal conductivity were -6.8%similar to 4.6% and -7.1%similar to 4.4%, respectively. Overall, the TDTR technology can evaluate the thermal-transport characteristics of micron-scale intermetallic compounds in electronic packaging and guide the thermal design and reliability evaluations of electronic components. |
| 资助项目 | National Natural Science Foundation of China[51971231] ; National Natural Science Foundation of China[52105327] ; National Natural Science Foundation of China[51720105007] ; National Key Scientific Instrument and Equipment Development Projects of China[2013YQ120355] ; Fundamental Research Funds for the Central Universities |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000905303700011 |
| 出版者 | SCIENCE PRESS |
| 资助机构 | National Natural Science Foundation of China ; National Key Scientific Instrument and Equipment Development Projects of China ; Fundamental Research Funds for the Central Universities |
| 源URL | [http://ir.imr.ac.cn/handle/321006/175477]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Guo Jingdong; Sun Fangyuan |
| 作者单位 | 1.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 2.Guilin Univ Elect Technol, Sch Mech & Elect Engn, Guilin 541004, Peoples R China 3.Univ Sci & Technol Beijing, Sch Energy & Environm Engn, Beijing 100083, Peoples R China 4.Dalian Univ Technol, Sch Energy & Power Engn, Dalian 116024, Peoples R China 5.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhou Lijun,Wei Song,Guo Jingdong,et al. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. ACTA METALLURGICA SINICA,2022,58(12):1645-1654. |
| APA | Zhou Lijun,Wei Song,Guo Jingdong,Sun Fangyuan,Wang Xinwei,&Tang Dawei.(2022).Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System.ACTA METALLURGICA SINICA,58(12),1645-1654. |
| MLA | Zhou Lijun,et al."Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System".ACTA METALLURGICA SINICA 58.12(2022):1645-1654. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。