Effects of stacking fault energy on deformation induced grain boundary relaxation in nanograined Cu alloys
文献类型：期刊论文
| 作者 | Sun, Y. A.1,2; Luo, Z. P.1; Li, X. Y.1; Lu, K.1 |
| 刊名 | ACTA MATERIALIA
 |
| 出版日期 | 2022-10-15 |
| 卷号 | 239页码:9 |
| 关键词 | Nanograined metals Grain boundary relaxation Thermal stability Stacking fault energy Cu alloys |
| ISSN号 | 1359-6454 |
| DOI | 10.1016/j.actamat.2022.118256 |
| 通讯作者 | Li, X. Y.(xyli@imr.ac.cn) |
| 英文摘要 | Deformation induced grain boundary (GB) relaxation with resultant enhancements in thermal stability was observed in various metals with grain sizes below a critical size. In this study, effects of stacking fault energy (SFE) on the GB relaxation and thermal stability are investigated in several Cu-Ni and Cu-Al alloys with gradient nanograined samples prepared using the surface mechanical grinding treatment. For each alloy, thermal stability drops with a decreasing grain size from submicrometers to about 70 nm. However, two distinct grain size dependences of thermal stability were observed below 70 nm. For Cu-10Ni and Cu-5Ni alloys with higher SFEs than Cu, thermal stability increases for smaller grains, similar to that in pure Cu. For Cu-10Al and Cu-5Al with lower SFEs than Cu, as grain sizes decrease the thermal stability elevates firstly and then drops, exhibiting a stability peak at a certain size. The observed thermal stability in the Cu alloys below 70 nm can be attributed to the GB relaxation induced by plastic deformation dominated by partial dislocation activities. The different behaviors of GB relaxation in these Cu alloys demonstrated its obvious dependence on SFE, which determined the governing deformation mechanisms and hence the degree of relaxation of GBs.(c) 2022 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 资助项目 | CAS -HK Joint Laboratory of Nanomaterials and Mechanics ; Ministry of Science and Technology of the People?s Republic of China[2017YFA0700700] ; Ministry of Science and Technology of the People?s Republic of China[2017YFA0204401] |
| WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000861076600001 |
| 出版者 | PERGAMON-ELSEVIER SCIENCE LTD |
| 资助机构 | CAS -HK Joint Laboratory of Nanomaterials and Mechanics ; Ministry of Science and Technology of the People?s Republic of China |
| 源URL | [http://ir.imr.ac.cn/handle/321006/175806]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Li, X. Y. |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Sun, Y. A.,Luo, Z. P.,Li, X. Y.,et al. Effects of stacking fault energy on deformation induced grain boundary relaxation in nanograined Cu alloys[J]. ACTA MATERIALIA,2022,239:9. |
| APA | Sun, Y. A.,Luo, Z. P.,Li, X. Y.,&Lu, K..(2022).Effects of stacking fault energy on deformation induced grain boundary relaxation in nanograined Cu alloys.ACTA MATERIALIA,239,9. |
| MLA | Sun, Y. A.,et al."Effects of stacking fault energy on deformation induced grain boundary relaxation in nanograined Cu alloys".ACTA MATERIALIA 239(2022):9. |
入库方式： OAI收割
来源：金属研究所
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