中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Research progress of the liquid cold plate cooling technology for server electronic chips: A review

文献类型:期刊论文

作者Zhou, Weinan1,2,3; Dong, Kaijun1,2; Sun, Qin1,2; Luo, Weimin1,2; Zhang, Bobo1,2; Guan, Shengli4; Wang, Guangwu4
刊名INTERNATIONAL JOURNAL OF ENERGY RESEARCH
出版日期2022-04-26
页码22
关键词heat transfer enhancement liquid cold plate microchannel server electronics chips
ISSN号0363-907X
DOI10.1002/er.7979
通讯作者Sun, Qin(sunqinsq@hotmail.com)
英文摘要A significant quantity of research has been dedicated to the application of liquid cold plates to eliminate the high heat flux in server electronic chips. Traditional parallel straight microchannel liquid cold plates suffer from low heat flux density with uneven flow distribution, which poses a serious challenge to high-performance server chip heat dissipation. This paper reviews recent research progress in geometry optimization, interrupted structures, channel patterns, and two-phase flow of liquid cold plates. The optimal geometry parameters of rectangular cross-sectional microchannels including the aspect ratio, length, and hydraulic diameter are summarized. Inquest of higher thermal performance, various interrupted structures (ribs, pin fins, etc.), special channel patterns (wavy-shaped, zigzag-shaped, fractal, serpentine, and double-layered microchannels, etc.), and two-phase flow on the liquid cold plate are applied to promote fluid-turbulivity and increase heat transfer area, meanwhile they lead to more pressure drop. Furthermore, it is an essential approach to commercialize liquid cold plates by applying the academic and prototype of the liquid cold plate to manufacturing and liquid cooling system solutions. In the end, this review provides a discussion about the limitations of current research on liquid cold plates and an outlook on future research directions.
WOS关键词MICROCHANNEL HEAT SINK ; THERMAL-HYDRAULIC PERFORMANCE ; FLUID-FLOW CHARACTERISTICS ; FAN-SHAPED RIBS ; ASPECT RATIO ; LAMINAR-FLOW ; HYDROTHERMAL PERFORMANCE ; PRESSURE CHARACTERISTICS ; NUMERICAL OPTIMIZATION ; TRANSFER SIMULATIONS
资助项目Guangdong Basic and Applied Basic Research Foundation[2019A1515111177] ; Guangzhou Science and Technology Project[202206010026] ; International Cooperation Project of Guangzhou Development District, China[2019GH01]
WOS研究方向Energy & Fuels ; Nuclear Science & Technology
语种英语
WOS记录号WOS:000787608600001
出版者WILEY
资助机构Guangdong Basic and Applied Basic Research Foundation ; Guangzhou Science and Technology Project ; International Cooperation Project of Guangzhou Development District, China
源URL[http://ir.giec.ac.cn/handle/344007/36300]  
专题中国科学院广州能源研究所
通讯作者Sun, Qin
作者单位1.Guangdong Prov Key Lab New & Renewable Energy Res, Guangzhou, Peoples R China
2.Chinese Acad Sci, Guangzhou Inst Energy Convers, Guangzhou, Peoples R China
3.Univ Chinese Acad Sci, Beijing, Peoples R China
4.Guangzhou Goaland Energy Conservat Tech Co Ltd, Guangzhou, Peoples R China
推荐引用方式
GB/T 7714
Zhou, Weinan,Dong, Kaijun,Sun, Qin,et al. Research progress of the liquid cold plate cooling technology for server electronic chips: A review[J]. INTERNATIONAL JOURNAL OF ENERGY RESEARCH,2022:22.
APA Zhou, Weinan.,Dong, Kaijun.,Sun, Qin.,Luo, Weimin.,Zhang, Bobo.,...&Wang, Guangwu.(2022).Research progress of the liquid cold plate cooling technology for server electronic chips: A review.INTERNATIONAL JOURNAL OF ENERGY RESEARCH,22.
MLA Zhou, Weinan,et al."Research progress of the liquid cold plate cooling technology for server electronic chips: A review".INTERNATIONAL JOURNAL OF ENERGY RESEARCH (2022):22.

入库方式: OAI收割

来源:广州能源研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。