Improving Seed-Based FPGA Packing with Indirect Connection for Realization of Neural Networks
文献类型:期刊论文
作者 | Yu, Le3; Guo, Baojin3; Zhi, Tian1; Bai, Lida2 |
刊名 | ELECTRONICS
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出版日期 | 2023-06-01 |
卷号 | 12期号:12页码:13 |
关键词 | FPGA EDA packing seed-based indirect connections |
DOI | 10.3390/electronics12122691 |
英文摘要 | FPGAs are gaining favor among researchers in fields including artificial intelligence and big data due to their configurability and high level of parallelism. As the packing methods indisputably affect the implementation performance of FPGA chips, packing techniques play an important role in the design automation flow of FPGAs. In this paper, we propose a quantitative rule for packing priority of neural network circuits, and optimize the traditional seed-based packing methods with special primitives. The experiment result indicates that the proposed packing method achieves an average decrease of 8.45% in critical path delay compared to the VTR8.0 on Koios deep learning benchmarks. |
WOS研究方向 | Computer Science ; Engineering ; Physics |
语种 | 英语 |
WOS记录号 | WOS:001014275500001 |
出版者 | MDPI |
源URL | [http://119.78.100.204/handle/2XEOYT63/21227] ![]() |
专题 | 中国科学院计算技术研究所期刊论文_英文 |
通讯作者 | Yu, Le |
作者单位 | 1.Chinese Acad Sci, Inst Comp Technol, Beijing 100190, Peoples R China 2.Shandong Cwise Microelect Technol Co Ltd, Jinan 250102, Peoples R China 3.Beijing Technol & Business Univ, Sch Artificial Intelligence, Beijing 100048, Peoples R China |
推荐引用方式 GB/T 7714 | Yu, Le,Guo, Baojin,Zhi, Tian,et al. Improving Seed-Based FPGA Packing with Indirect Connection for Realization of Neural Networks[J]. ELECTRONICS,2023,12(12):13. |
APA | Yu, Le,Guo, Baojin,Zhi, Tian,&Bai, Lida.(2023).Improving Seed-Based FPGA Packing with Indirect Connection for Realization of Neural Networks.ELECTRONICS,12(12),13. |
MLA | Yu, Le,et al."Improving Seed-Based FPGA Packing with Indirect Connection for Realization of Neural Networks".ELECTRONICS 12.12(2023):13. |
入库方式: OAI收割
来源:计算技术研究所
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