Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages
文献类型:期刊论文
作者 | Deng, Liting1,2; Li, Te2; Wang, Zhenfu2; Zhang, Pu2; Wu, Shunhua1,2; Liu, Jiachen1,2; Zhang, Junyue1,2; Chen, Lang2; Zhang, Jiachen2; Huang, Weizhou1,2 |
刊名 | ELECTRONICS |
出版日期 | 2024-01 |
卷号 | 13期号:1 |
ISSN号 | 2079-9292 |
关键词 | die attach interface contact thermal resistance thermal management transient thermal analysis structure function high-power laser diode |
DOI | 10.3390/electronics13010203 |
产权排序 | 1 |
英文摘要 | The reliability of packaged laser diodes is heavily dependent on the quality of the die attach. Even a small void or delamination may result in a sudden increase in junction temperature, eventually leading to failure of the operation. The contact thermal resistance at the interface between the die attach and the heat sink plays a critical role in thermal management of high-power laser diode packages. This paper focuses on the investigation of interface contact thermal resistance of the die attach using thermal transient analysis. The structure function of the heat flow path in the T3ster thermal resistance testing experiment is utilized. By analyzing the structure function of the transient thermal characteristics, it was determined that interface thermal resistance between the chip and solder was 0.38 K/W, while the resistance between solder and heat sink was 0.36 K/W. The simulation and measurement results showed excellent agreement, indicating that it is possible to accurately predict the interface contact area of the die attach in the F-mount packaged single emitter laser diode. Additionally, the proportion of interface contact thermal resistance in the total package thermal resistance can be used to evaluate the quality of the die attach. |
语种 | 英语 |
出版者 | MDPI |
WOS记录号 | WOS:001139159500001 |
源URL | [http://ir.opt.ac.cn/handle/181661/97150] |
专题 | 西安光学精密机械研究所_瞬态光学技术国家重点实验室 |
通讯作者 | Li, Te |
作者单位 | 1.Univ Chinese Acad Sci, Beijing 100049, Peoples R China 2.Chinese Acad Sci, Xian Inst Opt & Precis Mech, State Key Lab Transient Opt & Photon, Xian 710119, Peoples R China |
推荐引用方式 GB/T 7714 | Deng, Liting,Li, Te,Wang, Zhenfu,et al. Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages[J]. ELECTRONICS,2024,13(1). |
APA | Deng, Liting.,Li, Te.,Wang, Zhenfu.,Zhang, Pu.,Wu, Shunhua.,...&Zhang, Rui.(2024).Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages.ELECTRONICS,13(1). |
MLA | Deng, Liting,et al."Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages".ELECTRONICS 13.1(2024). |
入库方式: OAI收割
来源:西安光学精密机械研究所
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