Microstructures and properties of Al-50%SiC composites for electronic packaging applications
文献类型：期刊论文
| 作者 | Teng Fei1; Yu Kun1; Luo Jie1; Fang Hongjie1; Shi Chunli1; Dai Yilong2; Xiong Hanqing2 |
| 刊名 | TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
 |
| 出版日期 | 2016 |
| 卷号 | 26期号:10页码:2647-2652 |
| 关键词 | THERMAL-EXPANSION BEHAVIOR METAL-MATRIX COMPOSITES VOLUME FRACTION PARTICLE-SIZE THERMOPHYSICAL PROPERTIES SICP/AL COMPOSITES SIC/AL COMPOSITES Al-50%SiC composites powder metallurgy thermal properties flexural strength electronic packaging material |
| ISSN号 | 1003-6326 |
| 其他题名 | Microstructures and properties of Al-50%SiC composites for electronic packaging applications |
| 英文摘要 | Al-50%SiC (volume fraction) composites containing different sizes of SiC particles (average sizes of 23, 38 and 75 mu m) were prepared by powder metallurgy. The influences of SiC particle sizes and annealing on the properties of the composites were investigated. The results show that SiC particles are distributed uniformly in the Al matrix. The coarse SiC particles result in higher coefficient of thermal expansion (CTE) and higher thermal conductivity (TC), while fine SiC particles decrease CTE and improve flexural strength of the composites. The morphology and size of SiC particles in the composite are not influenced by the annealing treatment at 400 degrees C for 6 h. However, the CTE and the flexural strength of annealed composites are decreased slightly, and the TC is improved. The TC, CTE and flexural strength of the Al/SiC composite with average SiC particle size of 75 mu m are 156 W/(m center dot K), 11.6x10(-6)K(-1) and 229 MPa, respectively. |
| 语种 | 英语 |
| CSCD记录号 | CSCD:5860567 |
| 源URL | [http://ir.yic.ac.cn/handle/133337/35103]  |
| 专题 | 中国科学院烟台海岸带研究所 |
| 作者单位 | 1.中国科学院烟台海岸带研究所 2.Cent S Univ, Sch Materials Sci & Engn, Changsha 410083, Hunan, Peoples R China |
| 推荐引用方式 GB/T 7714 | Teng Fei,Yu Kun,Luo Jie,et al. Microstructures and properties of Al-50%SiC composites for electronic packaging applications[J]. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,2016,26(10):2647-2652. |
| APA | Teng Fei.,Yu Kun.,Luo Jie.,Fang Hongjie.,Shi Chunli.,...&Xiong Hanqing.(2016).Microstructures and properties of Al-50%SiC composites for electronic packaging applications.TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,26(10),2647-2652. |
| MLA | Teng Fei,et al."Microstructures and properties of Al-50%SiC composites for electronic packaging applications".TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA 26.10(2016):2647-2652. |
入库方式： OAI收割
来源：烟台海岸带研究所
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