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Deformation behavior and mechanism of p-type (Bi,Sb)2Te3 alloy during three-point bending test at room temperature

文献类型:期刊论文

作者Wang, Qichen1,2; Ren, Jie1,2; Han, Fuzhou1,2; Guo, Wenbin3; Cao, Yi3; Li, Songbin3; Wu, Songquan3; Li, Geping1,2; Ali, Muhammad1,2; Hu, Jianan1,2
刊名MATERIALS CHARACTERIZATION
出版日期2023-12-01
卷号206页码:7
关键词(Bi,Sb)(2)Te-3 alloy Microstructural deformation Three-point bending test
ISSN号1044-5803
DOI10.1016/j.matchar.2023.113414
通讯作者Han, Fuzhou() ; Li, Geping(gpli@imr.ac.cn)
英文摘要In order to improve the machining process to engineer microstructure and defect types so as to further enhance the thermoelectric properties, it is desirable to understand the deformation behavior and mechanism of polycrystalline Bi2Te3 alloys. This work investigated the deformation behavior and mechanism of (Bi,Sb)(2)Te-3 alloy during three-point bending tests using electron backscatter diffraction (EBSD). Results indicated that both dislocation slip and twinning occurred during the bending tests. The twins with the twin orientation relationship of (0001)(M)//(0001)(T) were observed. In addition, the nano-grains extruded the coarse grains in such a way that coarse grains assumed an orientation vulnerable to fracture along the basal planes. Slip trace analysis revealed that 1/3<11(2)0> dislocation slipping on basal planes broke the Van der Waals bonds between the basal planes which eventually led grains to fracture. Additionally, a novel model was introduced that first incorporated the bending moment diagram in order to deduce the deformation process.
WOS研究方向Materials Science ; Metallurgy & Metallurgical Engineering
语种英语
WOS记录号WOS:001104682200001
出版者ELSEVIER SCIENCE INC
源URL[http://ir.imr.ac.cn/handle/321006/177443]  
专题金属研究所_中国科学院金属研究所
通讯作者Han, Fuzhou; Li, Geping
作者单位1.Univ Sci & Technol China, Sch Mat Sci & Engn, 96 JinZhai Rd, Hefei 230026, Anhui, Peoples R China
2.Chinese Acad Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Peoples R China
3.Jiangxi Copper Technol Res Acad Co Ltd, Nanchang 330096, Peoples R China
推荐引用方式
GB/T 7714
Wang, Qichen,Ren, Jie,Han, Fuzhou,et al. Deformation behavior and mechanism of p-type (Bi,Sb)2Te3 alloy during three-point bending test at room temperature[J]. MATERIALS CHARACTERIZATION,2023,206:7.
APA Wang, Qichen.,Ren, Jie.,Han, Fuzhou.,Guo, Wenbin.,Cao, Yi.,...&Gao, Xingpeng.(2023).Deformation behavior and mechanism of p-type (Bi,Sb)2Te3 alloy during three-point bending test at room temperature.MATERIALS CHARACTERIZATION,206,7.
MLA Wang, Qichen,et al."Deformation behavior and mechanism of p-type (Bi,Sb)2Te3 alloy during three-point bending test at room temperature".MATERIALS CHARACTERIZATION 206(2023):7.

入库方式: OAI收割

来源:金属研究所

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