中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Interfacial engineering of transition metal dichalcogenide/carbon heterostructures for electrochemical energy applications

文献类型:期刊论文

作者Chen, Biao4,5; Sui, Simi4,6; He, Fang4; He, Chunnian4,5,7; Cheng, Hui-Ming1,2; Qiao, Shi-Zhang3; Hu, Wenbin4,5,7; Zhao, Naiqin4,5
刊名CHEMICAL SOCIETY REVIEWS
出版日期2023-11-13
卷号52期号:22页码:7802-7847
ISSN号0306-0012
DOI10.1039/d3cs00445g
通讯作者He, Fang(fanghe@tju.edu.cn) ; Qiao, Shi-Zhang(s.qiao@adelaide.edu.au) ; Hu, Wenbin(wbhu@tju.edu.cn)
英文摘要To support the global goal of carbon neutrality, numerous efforts have been devoted to the advancement of electrochemical energy conversion (EEC) and electrochemical energy storage (EES) technologies. For these technologies, transition metal dichalcogenide/carbon (TMDC/C) heterostructures have emerged as promising candidates for both electrode materials and electrocatalysts over the past decade, due to their complementary advantages. It is worth noting that interfacial properties play a crucial role in establishing the overall electrochemical characteristics of TMDC/C heterostructures. However, despite the significant scientific contribution in this area, a systematic understanding of TMDC/C heterostructures' interfacial engineering is currently lacking. This literature review aims to focus on three types of interfacial engineering, namely interfacial orientation engineering, interfacial stacking engineering, and interfacial doping engineering, of TMDC/C heterostructures for their potential applications in EES and EEC devices. To accomplish this goal, a combination of experimental and theoretical approaches was used to allow the analysis and summary of the fundamental electrochemical properties and preparation strategies of TMDC/C heterostructures. Moreover, this review highlights the design and utilization of the interfacial engineering of TMDC/C heterostructures for specific EES and EEC devices. Finally, the challenges and opportunities of using interfacial engineering of TMDC/C heterostructures in practical EES and EEC devices are outlined. We expect that this review will effectively guide readers in their understanding, design, and application of interfacial engineering of TMDC/C heterostructures. This review provides a fundamental understanding of three types of interfacial engineering in TMDC/C heterostructures and provides guidance for designing interfacial engineering in TMDC/C heterostructures for electrochemical energy applications.
资助项目This work was supported by the National Natural Science Foundation of China (51972225, 51972226, and 52202281), the Young Elite Scientists Sponsorship Program by CAS (2022QNRC001), and Guangdong Basic and Applied Basic Research Foundation (2020A1515110745)[51972225] ; This work was supported by the National Natural Science Foundation of China (51972225, 51972226, and 52202281), the Young Elite Scientists Sponsorship Program by CAS (2022QNRC001), and Guangdong Basic and Applied Basic Research Foundation (2020A1515110745)[51972226] ; This work was supported by the National Natural Science Foundation of China (51972225, 51972226, and 52202281), the Young Elite Scientists Sponsorship Program by CAS (2022QNRC001), and Guangdong Basic and Applied Basic Research Foundation (2020A1515110745)[52202281] ; National Natural Science Foundation of China[2022QNRC001] ; Young Elite Scientists Sponsorship Program by CAS[2020A1515110745] ; Guangdong Basic and Applied Basic Research Foundation
WOS研究方向Chemistry
语种英语
WOS记录号WOS:001087688100001
出版者ROYAL SOC CHEMISTRY
资助机构This work was supported by the National Natural Science Foundation of China (51972225, 51972226, and 52202281), the Young Elite Scientists Sponsorship Program by CAS (2022QNRC001), and Guangdong Basic and Applied Basic Research Foundation (2020A1515110745) ; National Natural Science Foundation of China ; Young Elite Scientists Sponsorship Program by CAS ; Guangdong Basic and Applied Basic Research Foundation
源URL[http://ir.imr.ac.cn/handle/321006/177840]  
专题金属研究所_中国科学院金属研究所
通讯作者He, Fang; Qiao, Shi-Zhang; Hu, Wenbin
作者单位1.Chinese Acad Sci, Inst Technol Carbon Neutral, Shenzhen Inst Adv Technol, Fac Mat Sci & Energy Engn, Shenzhen 518055, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
3.Univ Adelaide, Sch Chem Engn & Adv Mat, Adelaide, SA 5005, Australia
4.Tianjin Univ, Tianjin Key Lab Composite & Funct Mat, Key Lab Adv Ceram & Machining Technol, Sch Mat Sci & Engn,Minist Educ, Tianjin 300350, Peoples R China
5.Tianjin Univ, Natl Ind Educ Platform Energy Storage, 135 Yaguan Rd, Tianjin 300350, Peoples R China
6.Hebei Univ Technol, Sch Mat Sci & Engn, Tianjin Key Lab Mat Laminating Fabricat & Interfac, Tianjin 300401, Peoples R China
7.Tianjin Univ, Joint Sch Natl Univ Singapore & Tianjin Univ, Int Campus, Fuzhou 350207, Peoples R China
推荐引用方式
GB/T 7714
Chen, Biao,Sui, Simi,He, Fang,et al. Interfacial engineering of transition metal dichalcogenide/carbon heterostructures for electrochemical energy applications[J]. CHEMICAL SOCIETY REVIEWS,2023,52(22):7802-7847.
APA Chen, Biao.,Sui, Simi.,He, Fang.,He, Chunnian.,Cheng, Hui-Ming.,...&Zhao, Naiqin.(2023).Interfacial engineering of transition metal dichalcogenide/carbon heterostructures for electrochemical energy applications.CHEMICAL SOCIETY REVIEWS,52(22),7802-7847.
MLA Chen, Biao,et al."Interfacial engineering of transition metal dichalcogenide/carbon heterostructures for electrochemical energy applications".CHEMICAL SOCIETY REVIEWS 52.22(2023):7802-7847.

入库方式: OAI收割

来源:金属研究所

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