Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density
文献类型：期刊论文
| 作者 | Zhu, Qing-Sheng1; Ding, Zi-Feng1; Wei, Xiang-Fu1; Guo, Jing-dong1; Wang, Xiao-Jing2 |
| 刊名 | MICROELECTRONICS RELIABILITY
 |
| 出版日期 | 2023-07-01 |
| 卷号 | 146页码:8 |
| 关键词 | Copper pillar bump Cu electroplating Leveler Interfacial voids Chip packaging |
| ISSN号 | 0026-2714 |
| DOI | 10.1016/j.microrel.2023.115030 |
| 通讯作者 | Zhu, Qing-Sheng(qszhu@imr.ac.cn) |
| 英文摘要 | This work investigated the effects of levelers on the electroplating performance and reliability of copper pillar bumps (CPBs) on wafer. Under large current density, the usage of Janus green B (JGB) or a commercial leveler (L1) could obtain a satisfied performance in flatness, co-planarity and growth rate. It was found that this qualified leveler possessed a remarkable electrochemical characteristic, i.e., strong convection dependent adsorption (CDA). The void growth at the plated CPBs/Sn-Ag soldering interface during thermal aging was greatly accelerated when the leveler was applied during electroplating. The mass spectrum analysis showed that the level of impurities in the plated CPBs using JGB was much higher than that plated without JGB. The usage of leveler could produce a high level of impurities in the plated CPBs, which accounted for the boosting of voids at the soldering interface during thermal aging. |
| 资助项目 | Science and Technology Plan Project of Yunnan province[202101BC070001- 007] ; National Natural Science Foundation of China (NSFC)[51471180] ; National Natural Science Foundation of China (NSFC)[51971231] |
| WOS研究方向 | Engineering ; Science & Technology - Other Topics ; Physics |
| 语种 | 英语 |
| WOS记录号 | WOS:001007122600001 |
| 出版者 | PERGAMON-ELSEVIER SCIENCE LTD |
| 资助机构 | Science and Technology Plan Project of Yunnan province ; National Natural Science Foundation of China (NSFC) |
| 源URL | [http://ir.imr.ac.cn/handle/321006/178174]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Zhu, Qing-Sheng |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Jiangsu Univ Sci & Technol, Coll Mat Sci & Engn, Zhenjiang 212001, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhu, Qing-Sheng,Ding, Zi-Feng,Wei, Xiang-Fu,et al. Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density[J]. MICROELECTRONICS RELIABILITY,2023,146:8. |
| APA | Zhu, Qing-Sheng,Ding, Zi-Feng,Wei, Xiang-Fu,Guo, Jing-dong,&Wang, Xiao-Jing.(2023).Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density.MICROELECTRONICS RELIABILITY,146,8. |
| MLA | Zhu, Qing-Sheng,et al."Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density".MICROELECTRONICS RELIABILITY 146(2023):8. |
入库方式： OAI收割
来源：金属研究所
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