Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint
文献类型：期刊论文
| 作者 | Bashir, M. Nasir5,6; Khan, Abdul Faheem4; Bashir, Shahid3; Bashir, Mohamed Bashir Ali5; Jamshaid, Muhammad2; Javed, Iqra1; Ali, Imran7 |
| 刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| 出版日期 | 2023-02-01 |
| 卷号 | 34期号:5页码:9 |
| ISSN号 | 0957-4522 |
| DOI | 10.1007/s10854-022-09646-z |
| 通讯作者 | Bashir, M. Nasir(mnasir@ceme.nust.edu.pk) |
| 英文摘要 | Downscaling of electronic devices increased the current density in the solder joint. High current density causes the rapid diffusion of Cu atoms which is the root cause of failure in lead-free solder joints. This study aims the investigation of the effects of Zn nanoparticles (NP) doped flux on the microstructure of SAC305 solder joint under high current. Electromigration (EM) test was conducted for SAC305 solder and SAC305 + 2 wt% Zn NP-doped solder joints at different time intervals of 192, 384, 768, and 1128 h under a current density of 1 x 10(4) A/cm(2). The temperature was maintained at 80 +/- 5 degrees C in the silicon oil bath during the EM test. The results showed that Zn NP-doped reduced the size of the interfacial IMC of the SAC305 solder joint after the reflow process. After the EM test, the cracks and damages were suppressed, and thickness variations at the cathode and anode were significantly controlled by adding Zn NP-doped flux into the SAC305 solder joint. |
| WOS研究方向 | Engineering ; Materials Science ; Physics |
| 语种 | 英语 |
| WOS记录号 | WOS:001011056700009 |
| 出版者 | SPRINGER |
| 源URL | [http://ir.imr.ac.cn/handle/321006/178591]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Bashir, M. Nasir |
| 作者单位 | 1.Univ Management & Technol, Sch Sci & Technol, Lahore, Pakistan 2.Bahauddin Zakariya Univ Multan, Fac Engn & Technol, Dept Mech Engn, Multan 60000, Pakistan 3.Univ Malaya, Higher Inst Ctr Excellence HICoE, UM Power Energy Dedicated Adv Ctr UMPEDAC, Wisma R&D, Level 4, Kuala Lumpur 59990, Malaysia 4.Inst Space Technol, Dept Mat Sci & Engn, 1 Natl Highway, Islamabad 44000, Pakistan 5.Jouf Univ, Coll Engn, Dept Mech Engn, Sakaka 72388, Saudi Arabia 6.Natl Univ Sci & Technol, Islamabad, Pakistan 7.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Bashir, M. Nasir,Khan, Abdul Faheem,Bashir, Shahid,et al. Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2023,34(5):9. |
| APA | Bashir, M. Nasir.,Khan, Abdul Faheem.,Bashir, Shahid.,Bashir, Mohamed Bashir Ali.,Jamshaid, Muhammad.,...&Ali, Imran.(2023).Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,34(5),9. |
| MLA | Bashir, M. Nasir,et al."Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 34.5(2023):9. |
入库方式： OAI收割
来源：金属研究所
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