Current-carrying wear behavior and the interface evolution of the Cu/Al tribological pair
文献类型：期刊论文
| 作者 | Lin, Y.1,5; Li, J. Z.6; Pan, J.1,5,6; Zhang, C.1,5; Ni, D. R.4; Chen, Q.3; Song, W. L.1,5; Lu, J. Y.2; Li, B.2; Liu, L.1,5 |
| 刊名 | ENGINEERING FAILURE ANALYSIS
 |
| 出版日期 | 2023-11-01 |
| 卷号 | 153页码:14 |
| 关键词 | Current-carrying wear Cu/Al tribological pairs Al deposit adhesion Interfacial microstructure |
| ISSN号 | 1350-6307 |
| DOI | 10.1016/j.engfailanal.2023.107549 |
| 通讯作者 | Pan, J.(jpan@hust.edu.cn) ; Liu, L.(lliu2000@mail.hust.edu.cn) |
| 英文摘要 | Cu/Al tribological pairs play a crucial role in maintaining the efficient operation of a wide range of engineering components. However, their durability is often compromised by wear-induced damage, which involves the accumulation of material at the Cu/Al friction interface. This study investigates the intricate wear behavior of Cu/Al tribological pairs under electrical current, with a specific emphasis on material transfer events occurring at the interface. Our findings reveal that the applied electric current exerts a lubricating effect on the sliding contact friction, resulting in reduced adhesive wear. However, it concurrently exacerbates fatigue-induced delamination, abrasive wear, and electrical wear. Through detailed analysis of interface temperatures and microstructure characterizations, we demonstrate that Al deposit adhesion occurs through interfacial metal mixing and nanoscale diffusion in the presence of only mechanical friction. Conversely, at high electrical currents, interfacial melting transpires, resulting in robust adhesion facilitated by the formation of an intermetallic compound. Our findings offer valuable insights into the microscopic adhesion events occurring in Cu/Al tribological pairs and provide guidance for developing innovative coating systems aimed at reducing material deposition in Cu/Al current-carrying friction interfaces. |
| 资助项目 | National Natural Science Foundation of China[92066202] ; National Natural Science Foundation of China[52001075] ; National Natural Science Foundation of China[92266103] ; National Natural Science Foundation of China[92166103] ; National Natural Science Foundation of China[52022100] ; China Postdoctoral Science Foundation[2021 M701290] ; Youth Innovation Promotion Association of the Chinese Academy of Sciences[2020194] |
| WOS研究方向 | Engineering ; Materials Science |
| 语种 | 英语 |
| WOS记录号 | WOS:001069957200001 |
| 出版者 | PERGAMON-ELSEVIER SCIENCE LTD |
| 资助机构 | National Natural Science Foundation of China ; China Postdoctoral Science Foundation ; Youth Innovation Promotion Association of the Chinese Academy of Sciences |
| 源URL | [http://ir.imr.ac.cn/handle/321006/179268]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Pan, J.; Liu, L. |
| 作者单位 | 1.Huazhong Univ Sci & Technol, Sch Mat Sci & Engn, Wuhan 430074, Peoples R China 2.Naval Univ Engn, Natl Key Lab Sci & Technol Vessel Integrated Power, Wuhan 430033, Peoples R China 3.Huazhong Univ Sci & Technol, Wuhan Natl High Magnet Field Ctr, Wuhan 430074, Peoples R China 4.Chinese Acad Sci, Shi Changxu Innovat Ctr Adv Mat, Inst Met Res, Shenyang 110016, Peoples R China 5.Huazhong Univ Sci & Technol, State Key Lab Mat Proc & Die & Mould Technol, Wuhan 430074, Peoples R China 6.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Lin, Y.,Li, J. Z.,Pan, J.,et al. Current-carrying wear behavior and the interface evolution of the Cu/Al tribological pair[J]. ENGINEERING FAILURE ANALYSIS,2023,153:14. |
| APA | Lin, Y..,Li, J. Z..,Pan, J..,Zhang, C..,Ni, D. R..,...&Liu, L..(2023).Current-carrying wear behavior and the interface evolution of the Cu/Al tribological pair.ENGINEERING FAILURE ANALYSIS,153,14. |
| MLA | Lin, Y.,et al."Current-carrying wear behavior and the interface evolution of the Cu/Al tribological pair".ENGINEERING FAILURE ANALYSIS 153(2023):14. |
入库方式： OAI收割
来源：金属研究所
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