Reliable WBG Devices Packaging by Forming Nano-Gradient Structures on Silver-Plated Substrates
文献类型：期刊论文
| 作者 | Zhang, Bowen3; Zhao, Zhiyuan3; Liu, Yi3; Ma, Haoxiang2 ; Shi, Chao1; Mei, Yun-Hui3
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| 刊名 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
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| 出版日期 | 2024-07-01 |
| 卷号 | 14期号:7页码:1156-1163 |
| 关键词 | Substrates Annealing Silver Nanoscale devices Sputtering Nanostructures Bonding Nano-gradient structure power electronic packaging reliability silver paste strength-ductility dilemma |
| ISSN号 | 2156-3950 |
| DOI | 10.1109/TCPMT.2024.3394526 |
| 英文摘要 | The coefficient of thermal expansion (CTE) mismatch between the chip, sintered silver paste, and substrate leads to the formation of voids and cracks, and ultimately to device failure. In this article, a nano-gradient structure is formed on the substrate through the combination of sputtering and annealing process, which effectively increases the shear strength of die-attach samples from 19.9 to 31.4 MPa. High reliability is achieved by nano-gradient substrate, the shear strength is reduced from 31.4 to 25.8 MPa after 1000 cycles thermal shock test (TST), and the overall shear strength degradation was only 17.8%. For die-attach samples after 1000 h of thermal aging test, the failure occurred at the interface of electroplating rather than the bonding interface between the nano-gradient silver layer and silver paste. The upper deformation-refractory nanocrystalline particles in the substrate suppressed fatigue crack initiation, while the lower coarse-crystalline interior effectively prevented the crack propagation, allowing the high reliability of die-attach samples. The formation of nano-gradient structures on the substrate enables the development of wide bandgap (WBG) devices with superior reliability in a rigorous operating environment. |
| WOS关键词 | AG ; RELIABILITY ; DUCTILITY ; STRENGTH ; METALS ; PASTE |
| 资助项目 | National Natural Science Foundation of China[52107203] ; National Natural Science Foundation of China[52177189] ; Tianjin Municipal Science and Technology Bureau[21JCJQJC00150] |
| WOS研究方向 | Engineering ; Materials Science |
| 语种 | 英语 |
| WOS记录号 | WOS:001294582500019 |
| 出版者 | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| 资助机构 | National Natural Science Foundation of China ; Tianjin Municipal Science and Technology Bureau |
| 源URL | [http://ir.idsse.ac.cn/handle/183446/11450]  |
| 专题 | 深海工程技术部_深海信息技术研究室 |
| 通讯作者 | Zhang, Bowen; Mei, Yun-Hui |
| 作者单位 | 1.Yancheng Inst Technol, Sch Text & Clothing, Yancheng 224000, Peoples R China 2.Chinese Acad Sci, Inst Deep Sea Sci & Engn, Sanya 572000, Peoples R China 3.Tiangong Univ, Sch Elect Engn, Tianjin 300350, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhang, Bowen,Zhao, Zhiyuan,Liu, Yi,et al. Reliable WBG Devices Packaging by Forming Nano-Gradient Structures on Silver-Plated Substrates[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2024,14(7):1156-1163. |
| APA | Zhang, Bowen,Zhao, Zhiyuan,Liu, Yi,Ma, Haoxiang,Shi, Chao,&Mei, Yun-Hui.(2024).Reliable WBG Devices Packaging by Forming Nano-Gradient Structures on Silver-Plated Substrates.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,14(7),1156-1163. |
| MLA | Zhang, Bowen,et al."Reliable WBG Devices Packaging by Forming Nano-Gradient Structures on Silver-Plated Substrates".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 14.7(2024):1156-1163. |
入库方式： OAI收割
来源：深海科学与工程研究所
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