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Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials

文献类型：期刊论文

作者An, Dongqi4,5; Gong, Guangping5; Xu, Dian3,5; Zhou ZX(周赞鑫)1,2; Li, Rui5; Su YW(苏业旺)1,2
刊名ADVANCED FUNCTIONAL MATERIALS
出版日期2024-12-05
页码25
关键词elastoplastic behavior flexible electronics metallic materials stretchable electronics
ISSN号1616-301X
DOI10.1002/adfm.202412796
通讯作者Li, Rui(ruili@dlut.edu.cn) ; Su, Yewang(yewangsu@imech.ac.cn)
英文摘要Metallic materials serving as indispensable conductors critically influence the performance of flexible electronics. Conventional structural designs have restricted metallic materials to exhibiting pure elastic deformation, but recent developments have emphasized an increased significance of plastic deformation, showing great potential for new breakthroughs in developing novel flexible electronics. This review first introduces the elastoplastic behavior of metallic materials, especially those capable of withstanding remarkable plastic deformation. The main design strategies toward flexible and stretchable electronics expanding elastic deformation range are then summarized, incorporating both strain alleviation and strain delocalization. Innovative studies exploiting plasticity for enhancing device performances or achieving shape-forming and reconfigurable electronics are further highlighted. Some perspectives on utilizing the elastoplastic behavior of metallic materials to innovate the next generation of flexible electronics are finally provided.
分类号一类
WOS关键词STRAIN-RATE SENSITIVITY ; SERPENTINE MICROSTRUCTURES ; ELECTRICAL-CONDUCTIVITY ; RECOVERABLE PLASTICITY ; DUCTILITY ; STRENGTH ; DESIGN ; DEFORMATION ; FABRICATION ; MECHANICS
资助项目National Natural Science Foundation of China ; Key Research Program of Frontier Sciences of the Chinese Academy of Sciences[ZDBS-LY-JSC014] ; CAS Interdisciplinary Innovation Team[JCTD-2020-03] ; [12172359] ; [12022209]
WOS研究方向Chemistry ; Science & Technology - Other Topics ; Materials Science ; Physics
语种英语
WOS记录号WOS:001370033600001
资助机构National Natural Science Foundation of China ; Key Research Program of Frontier Sciences of the Chinese Academy of Sciences ; CAS Interdisciplinary Innovation Team
其他责任者Li, Rui ; Su, Yewang
源URL[http://dspace.imech.ac.cn/handle/311007/97744]  
专题力学研究所_非线性力学国家重点实验室
作者单位1.Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China
2.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China;
3.Nanyang Technol Univ, Coll Engn, Sch Mech & Aerosp Engn, Singapore 639798, Singapore;
4.City Univ Hong Kong, Dept Architecture & Civil Engn, Hong Kong 999077, Peoples R China;
5.Dalian Univ Technol, Sch Mech & Aerosp Engn, State Key Lab Struct Anal, Optimizat & CAE Software Ind Equipment, Dalian 116024, Peoples R China;
推荐引用方式
GB/T 7714		 An, Dongqi,Gong, Guangping,Xu, Dian,et al. Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials[J]. ADVANCED FUNCTIONAL MATERIALS,2024:25.
APA An, Dongqi,Gong, Guangping,Xu, Dian,周赞鑫,Li, Rui,&苏业旺.(2024).Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials.ADVANCED FUNCTIONAL MATERIALS,25.
MLA An, Dongqi,et al."Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials".ADVANCED FUNCTIONAL MATERIALS (2024):25.

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来源：力学研究所

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