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Improving interfacial microstructure and mechanical properties of ODS-W/ Cu joints via anodization treatment and spark plasma sintering

文献类型：期刊论文

作者Xu, Dang2; Fu, Kaichao2; Sang, Changcheng2; Chen, Ruizhi2; Chen, Pengqi1,2,3; Lu, Yingwei1,2,3; Zhu, Dahuan4; Xu, Qiu5; Cheng, Jigui1,2,3
刊名JOURNAL OF NUCLEAR MATERIALS
出版日期2024-12-01
卷号601
关键词ODS-W/Cu joints Anodization treatment SPS bonding technology Interfacial microstructure Mechanical properties
ISSN号0022-3115
DOI10.1016/j.jnucmat.2024.155351
通讯作者Cheng, Jigui(jgcheng@hfut.edu.cn)
英文摘要The bonding properties at the interface between the first wall oxide dispersion strengthened tungsten (ODS-W) and the heat sink copper (Cu) are vital for their application in future nuclear fusion reactors. However, the immiscibility and significant differences in the coefficient of thermal expansion between ODS-W and Cu pose considerable challenges for bonding these two materials. This study utilizes anodization and hydrogen reduction processes to form a nanoporous structure on the surface of ODS-W, thereby achieving effective bonding between ODS-W and Cu by spark plasma sintering (SPS). The effects of the anodization parameters on the surface characteristics of ODS-W, and the influence of the bonding temperature on the interfacial microstructure and mechanical properties of the ODS-W/Cu joints were investigated. The results demonstrate that under an anodization condition of 50 V for 40 min, a nanoporous structure with an average pore size of about 90 nm can forms on the surfaces of ODS-W. This significantly increases the surface roughness, thereby enhancing the interfacial bonding of ODS-W with Cu during SPS. As the bonding temperature increases, the interfacial microstructure changes from linear to serrated shape, effectively suppressing crack propagation and forming a stronger mechanical interlock between ODS-W and Cu. This significantly enhances the mechanical properties of the joints. Typically, at a bonding temperature of 1000 degrees C, the tensile strength of the anodized ODS-W/Cu joints reaches 245.2 MPa, which is 157.9 % higher than that of directly bonded joints. Additionally, the tensile fracture primarily occurs within the Cu substrate, transitioning from brittle to ductile fracture modes.
WOS关键词THERMAL-CONDUCTIVITY ; CUCRZR ALLOY ; STRENGTH ; TUNGSTEN ; COPPER ; DEFECT
资助项目National Key R & D Pro-gram of China[2022YFE0109700] ; National Natural Science Foundation of China[52274361] ; National Natural Science Foundation of China[52004079]
WOS研究方向Materials Science ; Nuclear Science & Technology
语种英语
WOS记录号WOS:001299292400001
出版者ELSEVIER
资助机构National Key R & D Pro-gram of China ; National Natural Science Foundation of China
源URL[http://ir.hfcas.ac.cn:8080/handle/334002/134914]  
专题中国科学院合肥物质科学研究院
通讯作者Cheng, Jigui
作者单位1.Minist Educ, Engn Res Ctr High Performance Copper Alloy Mat & P, Hefei 230009, Peoples R China
2.Hefei Univ Technol, Sch Mat Sci & Engn, Hefei 230009, Peoples R China
3.Res Ctr Powder Met Engn & Technol Anhui Prov, Hefei 230009, Peoples R China
4.Chinese Acad Sci, Inst Plasma Phys, Hefei 230031, Peoples R China
5.Kyoto Univ, Inst Integrated Radiat & Nucl Sci, Osaka 5900494, Japan
推荐引用方式
GB/T 7714		 Xu, Dang,Fu, Kaichao,Sang, Changcheng,et al. Improving interfacial microstructure and mechanical properties of ODS-W/ Cu joints via anodization treatment and spark plasma sintering[J]. JOURNAL OF NUCLEAR MATERIALS,2024,601.
APA Xu, Dang.,Fu, Kaichao.,Sang, Changcheng.,Chen, Ruizhi.,Chen, Pengqi.,...&Cheng, Jigui.(2024).Improving interfacial microstructure and mechanical properties of ODS-W/ Cu joints via anodization treatment and spark plasma sintering.JOURNAL OF NUCLEAR MATERIALS,601.
MLA Xu, Dang,et al."Improving interfacial microstructure and mechanical properties of ODS-W/ Cu joints via anodization treatment and spark plasma sintering".JOURNAL OF NUCLEAR MATERIALS 601(2024).

入库方式： OAI收割

来源：合肥物质科学研究院

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