Evaluation of chemical mechanical polishing characteristics using mixed abrasive slurry: A study on polishing behavior and material removal mechanism
文献类型：期刊论文
| 作者 | Zhu, Xiaoxiao2,3; Ding, Juxuan2,3; Mo, Zhangchao2,3; Jiang, Xuesong1; Sun, Jifei1; Fu, Hao2,3; Gui, Yuziyu2,3; Ban, Boyuan2 ; Wang, Ling2; Chen, Jian1,2
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| 刊名 | APPLIED SURFACE SCIENCE
 |
| 出版日期 | 2025-01-15 |
| 卷号 | 679 |
| 关键词 | Chemical mechanical polishing (CMP) Ceria abrasive Diamond abrasive Interfacial chemical reaction Material removal mechanism |
| ISSN号 | 0169-4332 |
| DOI | 10.1016/j.apsusc.2024.161157 |
| 通讯作者 | Chen, Jian(jchen@ipp.ac.cn) |
| 英文摘要 | Chemical mechanical polishing (CMP) is currently the most widely used method for material removal and surface planarization of glass. An environmentally friendly method of improving polishing performance by using a mixed abrasive slurry of ceria and diamond was proposed in this study. The results of polishing experiments showed that compared with single ceria abrasive, the materials removal rate (MRR) of the mixed abrasive slurry increased from 82.7 nm/min to 109.6 nm/min, while the surface roughness (Ra) decreased from 26.4 nm to 0.6 nm after polishing. An amorphous reaction layer formed during the CMP process was observed directly using transmission electron microscopy. Thermodynamic analysis was conducted to investigate the interfacial chemical reactions during the polishing process. A model was proposed to describe the mechanism of the materials removal. |
| WOS关键词 | MECHANOCHEMICAL REACTIONS ; COMPOSITE-PARTICLES ; SURFACE ; CEO2 ; CMP ; WAFER ; PERFORMANCE ; EFFICIENCY ; GRITS ; CE3+ |
| 资助项目 | National Natural Science Foundation of China[51874272] ; National Natural Science Foundation of China[51804294] ; National Natural Science Foundation of China[52111540265] ; Anhui Provincial Natural Science Foundation[1808085ME121] ; Key Laboratory of Photovoltaic and Energy Conservation Materials, Chinese Academy of Science[PECL2021QN003] ; HFIPS President Foundation[YZJJZX202018] |
| WOS研究方向 | Chemistry ; Materials Science ; Physics |
| 语种 | 英语 |
| WOS记录号 | WOS:001312738400001 |
| 出版者 | ELSEVIER |
| 资助机构 | National Natural Science Foundation of China ; Anhui Provincial Natural Science Foundation ; Key Laboratory of Photovoltaic and Energy Conservation Materials, Chinese Academy of Science ; HFIPS President Foundation |
| 源URL | [http://ir.hfcas.ac.cn:8080/handle/334002/135221]  |
| 专题 | 中国科学院合肥物质科学研究院 |
| 通讯作者 | Chen, Jian |
| 作者单位 | 1.Hefei Comprehens Natl Sci Ctr, Inst Energy, Hefei 230031, Peoples R China 2.Chinese Acad Sci, Inst Solid State Phys, Key Lab Photovolta & Energy Conservat Mat, HFIPS, Hefei 230031, Peoples R China 3.Univ Sci & Technol China, Hefei 230026, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhu, Xiaoxiao,Ding, Juxuan,Mo, Zhangchao,et al. Evaluation of chemical mechanical polishing characteristics using mixed abrasive slurry: A study on polishing behavior and material removal mechanism[J]. APPLIED SURFACE SCIENCE,2025,679. |
| APA | Zhu, Xiaoxiao.,Ding, Juxuan.,Mo, Zhangchao.,Jiang, Xuesong.,Sun, Jifei.,...&Chen, Jian.(2025).Evaluation of chemical mechanical polishing characteristics using mixed abrasive slurry: A study on polishing behavior and material removal mechanism.APPLIED SURFACE SCIENCE,679. |
| MLA | Zhu, Xiaoxiao,et al."Evaluation of chemical mechanical polishing characteristics using mixed abrasive slurry: A study on polishing behavior and material removal mechanism".APPLIED SURFACE SCIENCE 679(2025). |
入库方式： OAI收割
来源：合肥物质科学研究院
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