Effect of different titanium addition methods on the properties of diamond/ Cu composites
文献类型：期刊论文
| 作者 | Wei, Chenlong1,2,3; Wang, Xuexiang1; Tong, Peng2,3 ; Wang, Peng1; Wen, Jun1
|
| 刊名 | JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
 |
| 出版日期 | 2024-07-01 |
| 卷号 | 31 |
| 关键词 | Titanium Diamond/Cu Bending strength Thermal conductivity Interface |
| ISSN号 | 2238-7854 |
| DOI | 10.1016/j.jmrt.2024.06.214 |
| 通讯作者 | Wei, Chenlong(993967078@qq.com) ; Tong, Peng(tongpeng@issp.ac.cn) |
| 英文摘要 | Due to the low bonding strength between diamond and copper, the thermal conductivity and mechanical strength of diamond/copper composites are affected. In order to improve the interface bonding strength, this paper prepared diamond/Cu composites with titanium element in two forms: adding titanium to the copper matrix and using titanium coated diamond particles, respectively. The microstructure and composition analysis of the materials were carried out through SEM, EDS, AFM, etc. The bending strength and thermal conductivity of titanium coated diamond/copper composites reached 230 MPa and 480 W/(m center dot K), respectively, which were higher than the bending strength and thermal conductivity of diamond/Cu composites with added titanium in the matrix (208 MPa and 127 W/(m center dot K) and significantly higher than the corresponding properties of pure diamond/Cu composites (69 MPa and 108 W/(m center dot K)). Pre coating a layer of titanium carbide on the surface of diamond can serve as a connecting bridge, effectively reducing interfacial thermal resistance and improving mechanical properties, which is more effective than adding titanium powder to the matrix to improve the bending strength and thermal conductivity of diamond/Cu composites. |
| WOS关键词 | HIGH THERMAL-CONDUCTIVITY ; CU/DIAMOND COMPOSITES ; COATED DIAMOND ; POWDER ; MICROSTRUCTURE ; PARTICLES ; COATINGS ; ELEMENT ; CR |
| 资助项目 | Scientific Research Preparation Plan Project of Anhui Province[2022AH051030] ; Special Purpose Chip System Level Packaging Engineering Research Center Open Project of Anhui Province[2022GCZXZD02] ; Horizontal Project for Enterprises of Anhui Province[230024] ; Natural Science Foundation of Anhui Province[2108085QD182] |
| WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:001265569900001 |
| 出版者 | ELSEVIER |
| 资助机构 | Scientific Research Preparation Plan Project of Anhui Province ; Special Purpose Chip System Level Packaging Engineering Research Center Open Project of Anhui Province ; Horizontal Project for Enterprises of Anhui Province ; Natural Science Foundation of Anhui Province |
| 源URL | [http://ir.hfcas.ac.cn:8080/handle/334002/136935]  |
| 专题 | 中国科学院合肥物质科学研究院 |
| 通讯作者 | Wei, Chenlong; Tong, Peng |
| 作者单位 | 1.Anqing Normal Univ, Sch Elect Engn & Intelligent Mfg, Anqing 246133, Peoples R China 2.Univ Sci & Technol China, Hefei 230026, Peoples R China 3.Chinese Acad Sci, Key Lab Mat Phys, Inst Solid State Phys, HFIPS, Hefei 230031, Peoples R China |
| 推荐引用方式 GB/T 7714 | Wei, Chenlong,Wang, Xuexiang,Tong, Peng,et al. Effect of different titanium addition methods on the properties of diamond/ Cu composites[J]. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,2024,31. |
| APA | Wei, Chenlong,Wang, Xuexiang,Tong, Peng,Wang, Peng,&Wen, Jun.(2024).Effect of different titanium addition methods on the properties of diamond/ Cu composites.JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,31. |
| MLA | Wei, Chenlong,et al."Effect of different titanium addition methods on the properties of diamond/ Cu composites".JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T 31(2024). |
入库方式： OAI收割
来源：合肥物质科学研究院
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