Teardrop-like micro pin fin coated nanotube arrays chip for enhancement of flow boiling electronics cooling
文献类型：期刊论文
| 作者 | Chen, Hongqiang1; Gao, Quan1; Ma, Xiang1; Li, Kai3,4 ; Du, Wangfang3,4; Li, Caifeng5; Zhang, Yonghai1; Wei, Jinjia1,2
|
| 刊名 | INTERNATIONAL JOURNAL OF THERMAL SCIENCES
 |
| 出版日期 | 2025-08-01 |
| 卷号 | 214页码:13 |
| 关键词 | Flow boiling Microchannel Nanotube array Thermal management |
| ISSN号 | 1290-0729 |
| DOI | 10.1016/j.ijthermalsci.2025.109854 |
| 通讯作者 | Ma, Xiang(maxiang7632@xjtu.edu.cn) ; Zhang, Yonghai(zyh002@xjtu.edu.cn) |
| 英文摘要 | Phase change flow boiling heat transfer in microchannel is a very efficient thermal management mode for highpower electronics/devices cooling. However, achieving comprehensive enhancement of flow boiling heat transfer performance at low power consumption is still challenging. Herein, we devised and manufactured a teardrop-like micro-pin-fin coated stable copper hydroxide nanotubes array chip surfaces (S-Nanotube), demonstrating their exceptional enhancement in flow boiling heat transfer efficiency. A series of experiments were conducted using HFE-7100 as a working fluid within a semi-open microchannel. Compared to the smooth surface, the critical heat flux (CHF) and the maximum boiling heat transfer coefficient (HTC) of the S-Nanotube is increased by 82.1 % (from 45.1 to 72.9 and then to 82.1 W/cm2) and 140.5 % (from 5955 to 11,325 and then to 14,316 W/m2 & sdot;K) at extremely low-pressure drop (<= 4 kPa), showing a high coefficient of performance (COP). The temperature of the onset of nucleate boiling on the S-Nanotube surface is reduced by 26.4 %, and the heat flux is greatly increased in a small wall temperature variations (Delta T <= 10 degrees C). In situ observation and analysis of the surface properties and the bubble dynamics, the S-Nanotube chip promotes the phase change heat transfer process by providing massive nucleation sites, reducing bubbles size and residence time, and enhancing the wicking wetting capacity. These findings provide guidance for the rational design of boiling heat transferenhanced surfaces and heat sinks and point the way to achieving efficient thermal management of power devices. |
| 资助项目 | National Key R & D Program of China[2022YFF0503502] ; Shaanxi Province Postdoctoral Research Project[2024BSHSDZZ157] ; Postdoctoral Fellowship Program of CPSF[GZC20241347] ; Joint Funds of the National Natural Science Foundation of China[U2141218] ; Young Talent Support Plan of Xi'an Jiaotong University[B23025] ; State Key Laboratory of Fluorine and Nitrogen Chemicals |
| WOS研究方向 | Thermodynamics ; Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:001487916600001 |
| 资助机构 | National Key R & D Program of China ; Shaanxi Province Postdoctoral Research Project ; Postdoctoral Fellowship Program of CPSF ; Joint Funds of the National Natural Science Foundation of China ; Young Talent Support Plan of Xi'an Jiaotong University ; State Key Laboratory of Fluorine and Nitrogen Chemicals |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/101589]  |
| 专题 | 力学研究所_国家微重力实验室 |
| 通讯作者 | Ma, Xiang; Zhang, Yonghai |
| 作者单位 | 1.Xi An Jiao Tong Univ, Sch Chem Engn & Technol, 28 West Xianning Rd, Xian 710049, Peoples R China 2.Xi An Jiao Tong Univ, Key Lab Multiphase Flow Power Engn, Xian 710049, Peoples R China 3.Chinese Acad Sci, Natl Micrograv Lab, Inst Mech, Beijing 100190, Peoples R China 4.Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100149, Peoples R China 5.Xian Shaangu Power Co Ltd, Xian 710075, Peoples R China |
| 推荐引用方式 GB/T 7714 | Chen, Hongqiang,Gao, Quan,Ma, Xiang,et al. Teardrop-like micro pin fin coated nanotube arrays chip for enhancement of flow boiling electronics cooling[J]. INTERNATIONAL JOURNAL OF THERMAL SCIENCES,2025,214:13. |
| APA | Chen, Hongqiang.,Gao, Quan.,Ma, Xiang.,Li, Kai.,Du, Wangfang.,...&Wei, Jinjia.(2025).Teardrop-like micro pin fin coated nanotube arrays chip for enhancement of flow boiling electronics cooling.INTERNATIONAL JOURNAL OF THERMAL SCIENCES,214,13. |
| MLA | Chen, Hongqiang,et al."Teardrop-like micro pin fin coated nanotube arrays chip for enhancement of flow boiling electronics cooling".INTERNATIONAL JOURNAL OF THERMAL SCIENCES 214(2025):13. |
入库方式： OAI收割
来源：力学研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。