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A novel photosensitive poly(amic acid) for reducing film thickness shrinkage after curing

文献类型：期刊论文

作者Chen, Qiuhua5; Liu YD(刘屹东)3,4; Peng, Xiaokang5; Zhou, Lei5; Lee, Jiongmin2; Song, Jianjun1; Min, Yonggang1,5
刊名MATERIALS TODAY COMMUNICATIONS
出版日期2025-07-01
卷号47页码:6
关键词Photosensitive Poly(amic acid) Thickness Shrinkage Crosslinking Thermal Property
DOI10.1016/j.mtcomm.2025.113210
通讯作者Min, Yonggang(ygmin@gdut.edu.cn)
英文摘要Film thickness shrinkage negatively impacted product yield and device packaging performance. Photosensitive polyimides (PSPIs) without adding crosslinkers and photosensitizers had low film thickness shrinkage after curing, but this design limited the diversity of PSPIs. We devised photosensitive poly(amic acid) (PSPAA) that requires additional crosslinkers. After exposure, PSPAA had a high degree of crosslinking and high thermal property, resulting in low film thickness shrinkage after curing. Finally, a fine negative image with a resolution of about 4 mu m was printed in a film approximately 1.00 mu m thick after being exposured to i-line at 7.5 J/cm2 and developed with a 0.25 % TMAH aqueous solution. The film thickness shrinkage after curing was about 20 %.
分类号二类
WOS关键词POLYIMIDES
资助项目National Natural Science Foundation of China[U20A20340] ; Dongguan Key Research & Development Program[20231200300192] ; Foshan Introducing Innovative and Entrepreneurial Teams[1920001000108] ; Guangzhou Hongmian Project[HMJH-2020-0012] ; Guangzhou High-Tech Zone International Science and Technology Cooperation Project[2021GH11] ; Strategic Priority Research Program of the Chinese Academy of Sciences[XDB0910303] ; High-level Innovation Research Institute Program of Guangdong Province[2020B0909010003/GARA2023001000]
WOS研究方向Materials Science
语种英语
WOS记录号WOS:001524389000001
资助机构National Natural Science Foundation of China ; Dongguan Key Research & Development Program ; Foshan Introducing Innovative and Entrepreneurial Teams ; Guangzhou Hongmian Project ; Guangzhou High-Tech Zone International Science and Technology Cooperation Project ; Strategic Priority Research Program of the Chinese Academy of Sciences ; High-level Innovation Research Institute Program of Guangdong Province
其他责任者Min, Yonggang
源URL[http://dspace.imech.ac.cn/handle/311007/102244]  
专题宽域飞行工程科学与应用中心
作者单位1.Guangzhou Liangyue Mat Technol Co Ltd, Guangzhou 510663, Peoples R China
2.Nanyang Technol Univ, Nanyang Environm & Water Res Inst, Residues & Resource Reclamat Ctr R3C, Singapore 637141, Singapore;
3.Guangdong Aerosp Res Acad, Guangzhou 511400, Peoples R China;
4.Chinese Acad Sci, Wide Range Flight Engn Sci & Applicat Ctr, Inst Mech, Beijing 100190, Peoples R China;
5.Guangdong Univ Technol, Sch Mat & Energy, Guangzhou 510006, Peoples R China;
推荐引用方式
GB/T 7714		 Chen, Qiuhua,Liu YD,Peng, Xiaokang,et al. A novel photosensitive poly(amic acid) for reducing film thickness shrinkage after curing[J]. MATERIALS TODAY COMMUNICATIONS,2025,47:6.
APA Chen, Qiuhua.,刘屹东.,Peng, Xiaokang.,Zhou, Lei.,Lee, Jiongmin.,...&Min, Yonggang.(2025).A novel photosensitive poly(amic acid) for reducing film thickness shrinkage after curing.MATERIALS TODAY COMMUNICATIONS,47,6.
MLA Chen, Qiuhua,et al."A novel photosensitive poly(amic acid) for reducing film thickness shrinkage after curing".MATERIALS TODAY COMMUNICATIONS 47(2025):6.

入库方式： OAI收割

来源：力学研究所

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