Cu-Modified Palladium Catalysts: Boosting Formate Electrooxidation via Interfacially OHad-Driven Had Removal
文献类型：期刊论文
| 作者 | Tang, Z; Li, YJ; Shi, LL; Zhang, KX; Ji, YJ; Wang, XX; Yao, YB; Liu, X; Wang, DW; Nie, KQ |
| 刊名 | ACS APPLIED MATERIALS & INTERFACES
 |
| 出版日期 | 2024 |
| 卷号 | 16期号:7页码:8742-8750 |
| ISSN号 | 1944-8244 |
| DOI | 10.1021/acsami.3c16623 |
| 文献子类 | Article |
| 电子版国际标准刊号 | 1944-8252 |
| WOS记录号 | WOS:001164672700001 |
| 源URL | [https://ir.ihep.ac.cn/handle/311005/305605]  |
| 专题 | 高能物理研究所_多学科研究中心 |
| 推荐引用方式 GB/T 7714 | Tang, Z,Li, YJ,Shi, LL,et al. Cu-Modified Palladium Catalysts: Boosting Formate Electrooxidation via Interfacially OHad-Driven Had Removal[J]. ACS APPLIED MATERIALS & INTERFACES,2024,16(7):8742-8750. |
| APA | Tang, Z.,Li, YJ.,Shi, LL.,Zhang, KX.,Ji, YJ.,...&Yan, YM.(2024).Cu-Modified Palladium Catalysts: Boosting Formate Electrooxidation via Interfacially OHad-Driven Had Removal.ACS APPLIED MATERIALS & INTERFACES,16(7),8742-8750. |
| MLA | Tang, Z,et al."Cu-Modified Palladium Catalysts: Boosting Formate Electrooxidation via Interfacially OHad-Driven Had Removal".ACS APPLIED MATERIALS & INTERFACES 16.7(2024):8742-8750. |
入库方式： OAI收割
来源：高能物理研究所
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