Exploring the evolution of texture and properties of ultrafine copper wire during high strain drawing process
文献类型：期刊论文
| 作者 | Liu, Jin-song1; Zhou, Yan1; Wang, Song-wei2; Chen, Shuai-feng2; Song, Hong-wu2; Zhang, Shi-hong2 |
| 刊名 | JOURNAL OF CENTRAL SOUTH UNIVERSITY
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| 出版日期 | 2025-03-07 |
| 页码 | 21 |
| 关键词 | Copper wires ultrafine wire drawing texture evolution tensile strength |
| ISSN号 | 2095-2899 |
| DOI | 10.1007/s11771-025-5896-4 |
| 通讯作者 | Wang, Song-wei(swwang16b@imr.ac.cn) ; Chen, Shuai-feng(chensf@imr.ac.cn) |
| 英文摘要 | The ultrafine copper wire with a diameter of 18 mu m is prepared via cold drawing process from the single crystal downcast billet (Phi 8 mm), taking a drawing strain to 12.19. In this paper, in-depth investigation of the microstructure feature, texture evolution, mechanical properties, and electrical conductivity of ultrafine wires ranging from Phi 361 mu m to Phi 18 mu m is performed. Specially, the microstructure feature and texture type covering the whole longitudinal section of ultrafine wires are elaborately characterized. The results show that the average lamella thickness decreases from 1.63 mu m to 102 nm during the drawing process. Whereas, inhomogeneous texture evolution across different wire sections was observed. The main texture type of copper wires are components of <111>, <001> and <112> orientations. Specifically, the peripheral region is primarily dominated by <111> and <112>, while the central region is <001> and <111>. As the drawing strain increases, the volume fraction of hard orientation <111> with low Schmid factor increase, where notably higher fraction of <111> is result from the consumption of <112> and <001> for the wire of Phi 18 mu m. For drawn copper wire of 18 mu m, superior properties are obtained with a tensile strength of 729.8 MPa and an electrical conductivity of 86.9% IACS. Furthermore, it is found that grain strengthening, dislocation strengthening, and texture strengthening are three primary strengthening mechanisms of drawn copper wire, while the dislocation density is main factor on the reducing of conductivity. |
| 资助项目 | Unveiled the list of commanders Key Core Common Technology Projects of Jian ; Basic Scientific Research Project of the Education Department of Liaoning Province[LJKMZ20220591] ; Natural Science Foundation Joint Fund for Innovation and Development Projects of Chongqing[CSTB2023NSCQ-LZX0116] |
| WOS研究方向 | Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:001438914900001 |
| 出版者 | JOURNAL OF CENTRAL SOUTH UNIV |
| 资助机构 | Unveiled the list of commanders Key Core Common Technology Projects of Jian ; Basic Scientific Research Project of the Education Department of Liaoning Province ; Natural Science Foundation Joint Fund for Innovation and Development Projects of Chongqing |
| 源URL |  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Wang, Song-wei; Chen, Shuai-feng |
| 作者单位 | 1.Shenyang Ligong Univ, Sch Mat Sci & Engn, Shenyang 110159, Peoples R China 2.Chinese Acad Sci, Shi Changxu Innovat Ctr Adv Mat, Inst Met Res, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Liu, Jin-song,Zhou, Yan,Wang, Song-wei,et al. Exploring the evolution of texture and properties of ultrafine copper wire during high strain drawing process[J]. JOURNAL OF CENTRAL SOUTH UNIVERSITY,2025:21. |
| APA | Liu, Jin-song,Zhou, Yan,Wang, Song-wei,Chen, Shuai-feng,Song, Hong-wu,&Zhang, Shi-hong.(2025).Exploring the evolution of texture and properties of ultrafine copper wire during high strain drawing process.JOURNAL OF CENTRAL SOUTH UNIVERSITY,21. |
| MLA | Liu, Jin-song,et al."Exploring the evolution of texture and properties of ultrafine copper wire during high strain drawing process".JOURNAL OF CENTRAL SOUTH UNIVERSITY (2025):21. |
入库方式： OAI收割
来源：金属研究所
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