Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays
文献类型：期刊论文
| 作者 | Wu, Zhitao1; Wang, Wendong2,3; Bao, Ding1; Wei, Song1,2; Li, Ruifeng1; Guo, Jingdong3 |
| 刊名 | APPLIED THERMAL ENGINEERING
 |
| 出版日期 | 2025-03-15 |
| 卷号 | 263页码:11 |
| 关键词 | Liquid metal Thermal-interface material Non-contact jetting Wetting characteristic Heat-transfer performance |
| ISSN号 | 1359-4311 |
| DOI | 10.1016/j.applthermaleng.2024.125258 |
| 通讯作者 | Wei, Song(weisong@guet.edu.cn) ; Li, Ruifeng(liruifeng8107@163.com) ; Guo, Jingdong(jdguo@imr.ac.cn) |
| 英文摘要 | Gallium-based liquid metals have notable advantages as thermal-interface materials (TIMs) in high-power electronics. Nevertheless, several crucial issues require attention, as the considerable fluidity of liquid metals may cause leakage through gaps between chips and heat sinks, posing the risk of short circuits in electronic components. Gallium and its alloys exhibit poor substrate wettability, giving rise to voids or weak bonds. Additionally, the annual production of gallium is limited, thereby necessitating the minimisation of its consumption. Therefore, this paper proposes a thermal interconnection structure with liquid metal as the heattransfer medium. A non-contact jetting technology was adopted to fabricate arrays of eutectic gallium-indium (EGaIn) alloy microdroplets, and a porous steel mesh was used to prevent unregulated flow of the liquid metal. Using a hydrogen chloride atmosphere enhanced the wetting characteristics of the liquid metal on the copper substrates. As the structured copper sheets were pressed together, the liquid metal did not escape, and a well-connected liquid-metal thermal interface layer was formed. Coupled with the encapsulation insulation protection, the issue of liquid metal leakage has been completely resolved. The total thermal resistance of the developed thermal interconnection structure was 2.5-3 K center dot mm2/W, which is considerably lower than that of conventional polymer-based TIMs, demonstrating superior heat-transfer performance in the practical powerdevice applications. |
| 资助项目 | National Natural Science Foun-dation of China[52105327] ; National Natural Science Foun-dation of China[51971231] ; Guangxi Nat-ural Science Foundation[2020GXNSFBA2297109] ; Guangxi Science and Technology Program[AD20297023] ; Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology[22-35-4-S018] |
| WOS研究方向 | Thermodynamics ; Energy & Fuels ; Engineering ; Mechanics |
| 语种 | 英语 |
| WOS记录号 | WOS:001397606200001 |
| 出版者 | PERGAMON-ELSEVIER SCIENCE LTD |
| 资助机构 | National Natural Science Foun-dation of China ; Guangxi Nat-ural Science Foundation ; Guangxi Science and Technology Program ; Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology |
| 源URL |  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Wei, Song; Li, Ruifeng; Guo, Jingdong |
| 作者单位 | 1.Guilin Univ Elect Technol, Sch Mech & Elect Engn, Guilin 541000, Peoples R China 2.Xi An Jiao Tong Univ, Shaoxing Tongyue Semicond Inst, Shaoxing 312000, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Wu, Zhitao,Wang, Wendong,Bao, Ding,et al. Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays[J]. APPLIED THERMAL ENGINEERING,2025,263:11. |
| APA | Wu, Zhitao,Wang, Wendong,Bao, Ding,Wei, Song,Li, Ruifeng,&Guo, Jingdong.(2025).Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays.APPLIED THERMAL ENGINEERING,263,11. |
| MLA | Wu, Zhitao,et al."Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays".APPLIED THERMAL ENGINEERING 263(2025):11. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。