Research on the Bounce Suppression of the 3-D Interpenetrating Cu-W
文献类型：期刊论文
| 作者 | Ying-Han1; Dongrui-Liu1; Shujun-Li2 |
| 刊名 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
 |
| 出版日期 | 2024-11-01 |
| 卷号 | 14期号:11页码:1995-2002 |
| 关键词 | Contacts Contactors Damping Skeleton Vibrations Springs Electromagnetics Contact bounce contactors Cu-W composite damping interpenetrating 3-D structure |
| ISSN号 | 2156-3950 |
| DOI | 10.1109/TCPMT.2024.3467120 |
| 通讯作者 | Shujun-Li(shjli@imr.ac.cn) |
| 英文摘要 | The bouncing of the contactor upon closing can cause adhesion of contacts and wear of the contact tips, and these factors directly influence the reliability and electrical longevity of the contactor. In this study, a 3-D interpenetrating Cu-W contact with rhombic dodecahedron (RD) skeleton was fabricated using 3-D printing and infiltration technology; some commercial Cu-W contacts were prepared as comparison. Based on Hertz contact theory and extended theory, combined with the Kelvin-Voigt spring damping model, the principle of energy dissipation in contactor contact collision was analyzed. The Young modulus and damping coefficient of the two types of Cu-W contacts were obtained through stress-strain experiments and damping experiments using an INSTRON 5582 testing machine and a DpV55 shaker. The contact bounce characteristics of the two contact tips under different contactor parameters were obtained using a contact bounce test device and finally validated in practical contactors. The results show that the RD-structured Cu-W contact tip with a higher damping coefficient has more internal friction and better energy absorption when subjected to collision impacts, effectively suppressing contact bounce and exhibiting superior anti-bounce performance, especially at high-speed closings. |
| WOS研究方向 | Engineering ; Materials Science |
| 语种 | 英语 |
| WOS记录号 | WOS:001371937300002 |
| 出版者 | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| 源URL |  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Shujun-Li |
| 作者单位 | 1.Shenyang Univ Technol, Key Lab Special Elect Machine & High Voltage Appar, Minist Educ, Shenyang 110870, Liaoning, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110870, Liaoning, Peoples R China |
| 推荐引用方式 GB/T 7714 | Ying-Han,Dongrui-Liu,Shujun-Li. Research on the Bounce Suppression of the 3-D Interpenetrating Cu-W[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2024,14(11):1995-2002. |
| APA | Ying-Han,Dongrui-Liu,&Shujun-Li.(2024).Research on the Bounce Suppression of the 3-D Interpenetrating Cu-W.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,14(11),1995-2002. |
| MLA | Ying-Han,et al."Research on the Bounce Suppression of the 3-D Interpenetrating Cu-W".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 14.11(2024):1995-2002. |
入库方式： OAI收割
来源：金属研究所
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