Effect of texture on the thermal conductivity and mechanical properties of silicon nitride ceramic
文献类型：期刊论文
| 作者 | Ye, C. C.1,2; Ma, K.3; Chen, H. M.1; Xiang, Z. L.1; Wei, W. Q.1 |
| 刊名 | CERAMICS INTERNATIONAL
 |
| 出版日期 | 2024-01-15 |
| 卷号 | 50期号:2页码:4014-4021 |
| 关键词 | Texture Silicon nitride Thermal conductivity Fracture toughness |
| ISSN号 | 0272-8842 |
| DOI | 10.1016/j.ceramint.2023.11.170 |
| 通讯作者 | Ye, C. C.(ychao333@wfu.edu.cn) ; Wei, W. Q.() |
| 英文摘要 | In this study investigated the texture, microstructure, and mechanical behavior of silicon nitride (Si3N4) ceramics were investigated using various techniques, including the orientation distribution function, X-ray diffraction, scanning electron microscopy and transmission electron microscopy. The orientation distribution of c-axis of the beta-Si3N4 phase derived from the hot-press sintering method, where the considerable orientation arrangement of grains was perpendicular (SPE sample) and parallel (SPA sample) to the hot-pressed direction. XRD analysis showed that the SPA sample had stronger {0001}<10-10> and {0001}<2-1-10> textures than those of the SPE sample. For these reasons, the SPE sample exhibited a lower thermal conductivity of 54 W (m K)(-1) than that of the SPA sample (91 W (m K)(-1)). The mechanical behavior of the Si3N4 ceramics was affected by the orientation arrangement of the grains. Analysis of the cracks on the surface of the Si3N4 ceramics at different indentation angles (0 degrees, 22.5 degrees, 45 degrees, and 67.5 degrees), revealed a rising tendency of fracture toughness in the Si3N4 ceramics, with values of 3.6 MPa m(1/2), 4.1 MPa m(1/2), 5.5 MPa m(1/2) and 6.1 MPa m(1/2), respectively. These results were attributed to the texture and close-packed hexagonal structure. |
| 资助项目 | China Scholarship Council (CSC) ; Weifang Science and Technology Development Foundation[2021GX001] |
| WOS研究方向 | Materials Science |
| 语种 | 英语 |
| WOS记录号 | WOS:001135724100001 |
| 出版者 | ELSEVIER SCI LTD |
| 资助机构 | China Scholarship Council (CSC) ; Weifang Science and Technology Development Foundation |
| 源URL |  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Ye, C. C.; Wei, W. Q. |
| 作者单位 | 1.Weifang Univ, Sch Machinery & Automat, Weifang 261061, Shandong, Peoples R China 2.Nankai Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Ye, C. C.,Ma, K.,Chen, H. M.,et al. Effect of texture on the thermal conductivity and mechanical properties of silicon nitride ceramic[J]. CERAMICS INTERNATIONAL,2024,50(2):4014-4021. |
| APA | Ye, C. C.,Ma, K.,Chen, H. M.,Xiang, Z. L.,&Wei, W. Q..(2024).Effect of texture on the thermal conductivity and mechanical properties of silicon nitride ceramic.CERAMICS INTERNATIONAL,50(2),4014-4021. |
| MLA | Ye, C. C.,et al."Effect of texture on the thermal conductivity and mechanical properties of silicon nitride ceramic".CERAMICS INTERNATIONAL 50.2(2024):4014-4021. |
入库方式： OAI收割
来源：金属研究所
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