Thermally induced reaction and transient hardening of miscible spinodoid alloys
文献类型:期刊论文
| 作者 | Guan, Huai1,2; Xie, Hui1; Li, Cui-Hong1; Jin, Hai-Jun1 |
| 刊名 | ACTA MATERIALIA
![]() |
| 出版日期 | 2024-02-15 |
| 卷号 | 265页码:12 |
| 关键词 | Spinodoid alloys Thermal stability Hardening Diffusion Coherent and semicoherent interfaces |
| ISSN号 | 1359-6454 |
| DOI | 10.1016/j.actamat.2023.119611 |
| 通讯作者 | Jin, Hai-Jun(hjjin@imr.ac.cn) |
| 英文摘要 | Spinodoid alloys prepared by dealloying and deposition exhibit a bicontinuous dual-phase nanostructure with (semi-)coherent interfaces, resembling some features of the structure formed in spinodal decompostion. Composition fluctuation in such material and its spinodal-like hardening may then be tuned via thermally induced interdiffusion, even in undecomposable alloys. This paper studied the annealing behavior of miscible Cu/Au and Ag/Au spinodoid alloys with semi-coherent and coherent interfaces respectively. While the interdiffusion-dominated interfacial mixing occurs in both alloys, this process is interrupted in the Cu/Au alloys by a recrystallization-like reaction due to the large lattice mismatch between Cu and Au. We also found that interdiffusion does not monotonically soften these materials; instead, hardening can be observed in both alloys at the early stage of annealing, though further annealing eventually leads to softening. Thermally induced transient hardening is attributed to the formation of a diffuse Cu/Au or Ag/Au interface whose barrier strength to dislocation transmission is enhanced comparing to the sharp interface before annealing. Localized solid solution hardening and the dissociation of misfit dislocations within the diffuse interface might have led to the increase of interfacial barrier strength. |
| 资助项目 | National Natural Science Founda-tion of China[51971218] ; Shenyang National Laboratory for Materials Science[L2021R36] |
| WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:001145776600001 |
| 出版者 | PERGAMON-ELSEVIER SCIENCE LTD |
| 资助机构 | National Natural Science Founda-tion of China ; Shenyang National Laboratory for Materials Science |
| 源URL | ![]() |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Jin, Hai-Jun |
| 作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China |
| 推荐引用方式 GB/T 7714 | Guan, Huai,Xie, Hui,Li, Cui-Hong,et al. Thermally induced reaction and transient hardening of miscible spinodoid alloys[J]. ACTA MATERIALIA,2024,265:12. |
| APA | Guan, Huai,Xie, Hui,Li, Cui-Hong,&Jin, Hai-Jun.(2024).Thermally induced reaction and transient hardening of miscible spinodoid alloys.ACTA MATERIALIA,265,12. |
| MLA | Guan, Huai,et al."Thermally induced reaction and transient hardening of miscible spinodoid alloys".ACTA MATERIALIA 265(2024):12. |
入库方式: OAI收割
来源:金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。

