Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy
文献类型：期刊论文
| 作者 | Wang, Liqiang1; Qu, Shuo2; Fu, Huangliu3; Zhou, Xin4; Hu, Zongxin2; Wen, Yaojie5; Zhang, Baicheng5; Gan, Bin6; Song, Xu2; Lu, Yang7 |
| 刊名 | ADDITIVE MANUFACTURING
 |
| 出版日期 | 2024-03-25 |
| 卷号 | 84页码:14 |
| 关键词 | Additive manufacturing Copper alloys Heterogeneous structure Nanoprecipitates In situ TEM |
| ISSN号 | 2214-8604 |
| DOI | 10.1016/j.addma.2024.104100 |
| 通讯作者 | Gan, Bin(ganb@szlab.ac.cn) ; Song, Xu(xsong@mae.cuhk.edu.hk) ; Lu, Yang(ylu1@hku.hk) |
| 英文摘要 | Employing a single strategy that overcomes the strength-ductility-conductivity trade-off in copper alloys has proven to be challenging. In this study, we introduced a novel heterogeneous nanoprecipitate-dislocation (HND) architecture in CuCrNb alloy consisting of a multi-modal core-shell grain structure and an interconnected dislocation network pinned by abundant nanoprecipitates. Our CuCrNb-HND alloy exhibited superior strength-ductility synergy at both room and elevated temperatures. In particular, aging treatment-induced highdensity coherent Cr secondary nanoprecipitates into the HND skeleton endowed the CuCrNb-HND450 alloy with a high tensile strength of over 1 GPa and a conductivity of similar to 50%, surpassing those of most of the reported additively manufactured copper alloys. An in situ transmission electron microscopy heating experiment revealed the superior thermal stability of the HND architecture. Hierarchical strengthening contributed to the enhancement of mechanical properties. At the micrometer scale, the harmonic grain structure with a strong fine-grained shell and a ductile coarse-grained core effectively improved mechanical properties by suppressing localized plastic deformation. At the nanometer scale, the synergistic effect of the nanoprecipitate-dislocation network further improved the alloy strength by slowing down dislocation movement. Overall, our proposed HND architecture provides an efficient pathway for developing high-strength and high-conductivity copper alloys. |
| 资助项目 | Hong Kong RGC General Research Fund[11200623] ; Collaborative Research Fund[C7074-23G] ; Key R & D Programmes from the Science and Technology Department of Sichuan Province (Key Science & Technology Project)[2022YFSY0001] ; Changsha Municipal Science and Technology Bureau[kh2201035] ; University Grants Committee (Hong Kong) Collaborative Research Fund[C4074-22G] ; University Grants Committee (Hong Kong) Collaborative Research Fund[C4002-22Y] ; Innovation and Technology Fund of the Government of the Hong Kong Special Administrative Region[ITP/028/22TP] |
| WOS研究方向 | Engineering ; Materials Science |
| 语种 | 英语 |
| WOS记录号 | WOS:001240715400001 |
| 出版者 | ELSEVIER |
| 资助机构 | Hong Kong RGC General Research Fund ; Collaborative Research Fund ; Key R & D Programmes from the Science and Technology Department of Sichuan Province (Key Science & Technology Project) ; Changsha Municipal Science and Technology Bureau ; University Grants Committee (Hong Kong) Collaborative Research Fund ; Innovation and Technology Fund of the Government of the Hong Kong Special Administrative Region |
| 源URL |  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Gan, Bin; Song, Xu; Lu, Yang |
| 作者单位 | 1.City Univ Hong Kong, Dept Mech Engn, Hong Kong, Peoples R China 2.Chinese Univ Hong Kong, Dept Mech & Automation Engn, Hong Kong, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang, Peoples R China 4.Westfalische Wilhelms Univ, Phys Inst, D-48149 Munster, Germany 5.Univ Sci & Technol Beijing, Inst Adv Mat & Technol, Beijing Adv Innovat Ctr Mat Genome Engn, Beijing 100083, Peoples R China 6.Suzhou Lab, 388 Ruoshui St, Suzhou 215123, Jiangsu, Peoples R China 7.Univ Hong Kong, Dept Mech Engn, Hong Kong, Peoples R China |
| 推荐引用方式 GB/T 7714 | Wang, Liqiang,Qu, Shuo,Fu, Huangliu,et al. Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy[J]. ADDITIVE MANUFACTURING,2024,84:14. |
| APA | Wang, Liqiang.,Qu, Shuo.,Fu, Huangliu.,Zhou, Xin.,Hu, Zongxin.,...&Lu, Yang.(2024).Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy.ADDITIVE MANUFACTURING,84,14. |
| MLA | Wang, Liqiang,et al."Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy".ADDITIVE MANUFACTURING 84(2024):14. |
入库方式： OAI收割
来源：金属研究所
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