Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials
文献类型：期刊论文
| 作者 | Wang, Wendong1,2; Wei, Song3; Du, Xinyu4; Zhu, Qingsheng1,2; Qiao, Yanxin4; Wang, Xiaojing4; Guo, Jingdong1,2 |
| 刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| 出版日期 | 2024-06-01 |
| 卷号 | 35期号:16页码:16 |
| ISSN号 | 0957-4522 |
| DOI | 10.1007/s10854-024-12848-2 |
| 通讯作者 | Wei, Song(swei2020@126.com) ; Guo, Jingdong(jdguo@imr.ac.cn) |
| 英文摘要 | Liquid metal-based thermal interface materials (TIMs) have garnered attention in the field of microelectronics due to their flowability and high thermal conductivity. In this study, Composite TIMs were developed using EGa-In-Sn (eutectic gallium-indium-tin) alloy and tungsten particles through a stirred grinding method. The effect of tungsten particle content on the thermal performance of the TIMs was investigated. Finite element analysis was employed to analyze the internal heat transfer behavior. Results demonstrated that the thermal conductivity of the composite TIMs initially increased and then decreased with increasing tungsten particle content, reaching a peak at nearly twice that of EGa-In-Sn alloy. The established two-dimensional model aligned with experimental data, facilitating predictions for the thermal conductivity of composite TIMs. Interconnected tungsten particles formed the primary heat flux channel, while voids impeded the heat flux. Particle spacing, contact mode and void size are the main factors affecting the heat conduction between tungsten particles. |
| 资助项目 | National Natural Science Foundation of China |
| WOS研究方向 | Engineering ; Materials Science ; Physics |
| 语种 | 英语 |
| WOS记录号 | WOS:001243368800002 |
| 出版者 | SPRINGER |
| 资助机构 | National Natural Science Foundation of China |
| 源URL |  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Wei, Song; Guo, Jingdong |
| 作者单位 | 1.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 3.Guilin Univ Elect Technol, Guangxi Key Lab Mfg Syst & Adv Mfg Technol, Guilin 541004, Peoples R China 4.Jiangsu Univ Sci & Technol, Coll Mat Sci & Engn, Zhenjiang 212001, Peoples R China |
| 推荐引用方式 GB/T 7714 | Wang, Wendong,Wei, Song,Du, Xinyu,et al. Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2024,35(16):16. |
| APA | Wang, Wendong.,Wei, Song.,Du, Xinyu.,Zhu, Qingsheng.,Qiao, Yanxin.,...&Guo, Jingdong.(2024).Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,35(16),16. |
| MLA | Wang, Wendong,et al."Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 35.16(2024):16. |
入库方式： OAI收割
来源：金属研究所
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