Ion beam polishing processing technology is a processing method developed in recent decades using high-energy ion  beams, which is suitable to removal and processing different materials, because its working process has incomparable  advantages compared to other processing methods. Process studies involving multiple materials in the same area have not  been reported. In this paper, the influence of Ion beam polishing processing technology parameters on the removal rate of  different materials in a small area is studied experimentally, and the removal rate of high-purity  silica glass, doped  silica  glass and epoxy resin adhesive layer is tested by single factor and orthogonal test method, and the corresponding removal  rate prediction formula is established through analysis. Experiments show that within a certain range of process parameters,  gate voltage, gate current and gate size have obvious effects on the removal rate, while working distance and step size have  the lowest impact. Prediction formulas and experiments are used to derive optimal process parameters for simultaneous  removal of different materials.