Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I
文献类型：期刊论文
| 作者 | Hao, Qinfen1; Chen, Kuan-Neng2; Goel, Sandeep Kumar3; Li, Hai4; Marinissen, Erik Jan5 |
| 刊名 | IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS
 |
| 出版日期 | 2025-09-01 |
| 卷号 | 15期号:3页码:362-367 |
| 关键词 | Special issues and sections Chiplets Circuits and systems Electronic design automation and methodology Packaging |
| ISSN号 | 2156-3357 |
| DOI | 10.1109/JETCAS.2025.3600772 |
| WOS研究方向 | Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:001576681500008 |
| 出版者 | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| 源URL | [http://119.78.100.204/handle/2XEOYT63/41698]  |
| 专题 | 中国科学院计算技术研究所期刊论文_英文 |
| 通讯作者 | Hao, Qinfen |
| 作者单位 | 1.Chinese Acad Sci, Inst Comp Technol, Beijing 100190, Peoples R China 2.Natl Yang Ming Chiao Tung Univ, Inst Elect, Hsinchu 30010, Taiwan 3.Taiwan Semicond Mfg Co TSMC, San Jose, CA 95124 USA 4.Duke Univ, Elect & Comp Engn Dept, Durham, NC 27708 USA 5.imec, B-3001 Leuven, Belgium |
| 推荐引用方式 GB/T 7714 | Hao, Qinfen,Chen, Kuan-Neng,Goel, Sandeep Kumar,et al. Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I[J]. IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS,2025,15(3):362-367. |
| APA | Hao, Qinfen,Chen, Kuan-Neng,Goel, Sandeep Kumar,Li, Hai,&Marinissen, Erik Jan.(2025).Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I.IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS,15(3),362-367. |
| MLA | Hao, Qinfen,et al."Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I".IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS 15.3(2025):362-367. |
入库方式： OAI收割
来源：计算技术研究所
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